公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K. K.; Kuo, C. N.; Wu, T. L.; Chen, W. L.; Wu, Ruey-Beei | 1992 Electrical Performance of Electronic Packaging | 2 | 0 | |
1992 | Inductance and Resistance Computations for Three-Dimensional Multiconductor Interconnection Structures | Wu, Ruey-Beei ; Kuo, C. N.; Chang, K. K. | IEEE Transactions on Microwave Theory and Techniques | 59 | 0 |