公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1994 | 2-(N-methylanilino)-2-phenylsulfanylacetonitrile, a reagent tested for electrophilic, nucleophilic and radical reactions | Chen, C.-C.; Chen, S.-T.; Chuang, T.-H.; JIM-MIN FANG | Journal of the Chemical Society, Perkin Transactions 1 | | | |
2006 | Abnormal growth of tin whiskers in a Sn<inf>3</inf>Ag0.5Cu0.5Ce solder ball grid array package | Chuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2015 | Applications of Ag-Alloy stud bump for IC and LED packages | Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings | | | |
2019 | Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2020 | Bondability of Pd and Au Containing Ag-Alloy Wires on Au Pads for LED Package | Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | 7 | |
2006 | Bragg scattering of surface plasmon polaritons on extraordinary transmission through silver periodic perforated hole arrays | Tsai, M.-W.; Chuang, T.-H.; Chang, H.-Y.; SI-CHEN LEE | Applied Physics Letters | | | |
2017 | Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application | Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Vacuum | | | |
2000 | Characterization of alumina ceramics by ultrasonic testing | Chang, L.-S.; Chuang, T.-H.; TUNG-HAN CHUANG ; WEN-CHENG J. WEI | Materials Characterization | 45 | 41 | |
2019 | Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres | Wen, C.-K.; Xin, Y.-Q.; Chen, S.-C.; Chuang, T.-H.; Chen, P.-J.; Sun, H.; TUNG-HAN CHUANG | Thin Solid Films | | | |
2021 | Comprehensive Non-volatile Photo-programming Transistor Memory via a Dual-Functional Perovskite-Based Floating Gate | Yang, W.-C.; Lin, Y.-C.; Liao, M.-Y.; Hsu, L.-C.; Lam, J.-Y.; Chuang, T.-H.; Li, G.-S.; Yang, Y.-F.; CHU-CHEN CHUEH ; WEN-CHANG CHEN | ACS Applied Materials and Interfaces | | | |
2007 | Coupling between surface plasmons via thermal emission of a dielectric layer sandwiched between two metal periodic layers | Tsai, M.-W.; Chen, C.-Y.; Jiang, Y.-W.; Ye, Y.-H.; Chang, H.-Y.; Chuang, T.-H.; SI-CHEN LEE | Applied Physics Letters | 4 | 3 | |
1989 | Discontinuous coarsening and dissolution in an Fe13.5at.%Zn solid solution | Chuang, T.-H.; Gust, W.; Predel, B.; Fournelle, R.A.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
1998 | Discontinuous coarsening of discontinuous precipitates in a Co-6 at.% Mo alloy | Lee, S.-L.; Lee, K.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
2006 | Dispersion of surface plasmon polaritons on silver film with rectangular hole arrays in a square lattice | Tsai, M.-W.; Chuang, T.-H.; Chang, H.-Y.; SI-CHEN LEE | Applied Physics Letters | 33 | 31 | |
2007 | Dispersion relation of Al/Si surface plasmon in hexagonally ordered aluminum hole arrays | Chang, Y.-T.; Chuang, T.-H.; Tsai, M.-W.; Chen, L.-C.; SI-CHEN LEE | Journal of Applied Physics | 17 | 16 | |
2012 | Dual-phase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG | Chang, T.-C.; Chang, J.-Y.; Chuang, T.-H.; Lo, W.-C.; TUNG-HAN CHUANG | 14th International Conference on Electronic Materials and Packaging, EMAP 2012 | | | |
2014 | Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2020 | Eco-Friendly Polyfluorene/Poly(butylene succinate) Blends and Their Electronic Device Application on Biodegradable Substrates | Hsieh, H.-C.; Wu, N.; Chuang, T.-H.; Lee, W.-Y.; Chen, J.-Y.; WEN-CHANG CHEN | ACS Applied Polymer Materials | | | |
2009 | Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy | Chuang, T.-H.; Chi, C.-C.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |