公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen, W. T.; Ho, C. E.; Kao, and C. R. | Journal of Materials Research | | | |
1999 | Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system | Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R. | Materials Transactions, JIM | | | |
2002 | Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau, L. C.; Ho, C. E.; Kao, and C. R. | Soldering and Surface Mount Technology | | | |
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder | Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Chemistry of Materials | | | |
2005 | Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations | Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. | Materials Science and Engineering A | | | |