公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2007 | Effect of Zn addition on the interfacial reactions between Cu and lead-free solders | Yang S.-C.; Ho C.-E.; Chang C.-W.; C. ROBERT KAO | Materials Research Society Symposium | |||
2007 | Massive spalling of intermetallic compound in lead-free solder joints | Yang S.-C.; Ho C.-E.; Chang C.-W.; C. ROBERT KAO | Materials Research Society Symposium | |||
2022 | Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Tseng S.-C; Tang M.-T; Chiang C.-Y; C. ROBERT KAO ; Ho C.-E. | Scripta Materialia | 2 | 2 | |
2021 | White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5 | Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO | 2021 International Conference on Electronics Packaging, ICEP 2021 |