公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing | Huang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Scripta Materialia | 55 | 52 | |
2017 | First report of rust caused by puccinia kusanoi affecting yushan cane (Yushania niitakayamensis) in Taiwan | Shen Y.M.; Huang T.C.; Chung W.H.; TING-HSUAN HUNG | Plant Disease | |||
2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |
1998 | Two fatal cases of Veillonella bacteremia [2] | Liu J.W.; Wu J.J.; Wang L.R.; LEE-JENE TENG ; Huang T.C. | European Journal of Clinical Microbiology and Infectious Diseases | 21 | 16 |