公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2022 | Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating | Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
2023 | Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer | Kung, P. Y.; Huang, W. L.; Kao, C. L.; Hung, Y. C.; C. ROBERT KAO | 2023 International Conference on Electronics Packaging, ICEP 2023 | 0 | 0 | |
2023 | Enhanced Reactivity of Electroless Cu Interconnection by Surface Oxidation Pretreatment | Lin, Y. C.; Shen, C. H.; Hung, C. Y.; Shih, P. S.; Huang, J. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; C. ROBERT KAO | 2023 International Conference on Electronics Packaging, ICEP 2023 | 0 | 0 | |
1993 | On the Quickest Path Problem | 陳健輝 ; Hung, Y. C.; Chen, Gen-Huey | Information Processing Letters | | | |
1992 | On the Quickest Path Problem | Hung, Y. C.; 陳健輝 ; Chen, Gen-Huey | Advances in Computing and Information | | | |
1993 | Reverse Reachability Analysis:a New Technique for Deadlock Detection on Communicating Finite State Machines | Hung, Y. C.; 陳健輝 ; Chen, Gen-Huey | Software-Practice & Experience | | | |