公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2003 | Chemical reaction in advanced microelectronic packages | Ho, C. E.; Lin, Y. L.; Tsai, J. Y.; Kao, and C. R. | Journal of the Chinese Institute of Chemical Engineers | | | |
2005 | Controlling the microstructure from the gold-tin Reaction | Tsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2004 | Cross-interaction of UBM and soldering pad in flip-chip solder joints | Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2002 | Effect of copper concentration on the solid-state reactions between tin-copper lead-free solders and nicke | Chen, W. T.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. | Journal of Surface Mount Technology | | | |
2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen, W. T.; Ho, C. E.; Kao, and C. R. | Journal of Materials Research | | | |
2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. | Journal of Electronic Materials | | | |
2005 | Electromigration-induced grain rotation in anisotropic conducting beta-tin | Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. | Applied Physics Letters | | | |
1999 | Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system | Lee, M. S.; Chen, C.; Kao, and C. R. | Chemistry of Materials | | | |
2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R. | Journal of Electronic Materials | | | |
2002 | Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints | Ho, C. E.; Shiau, L. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho, C. E.; Chen, W. T.; Kao, and C. R. | Journal of Electronic Materials | | | |
2000 | Optimizing the wire-bonding parameters for second bond in ball grid array packages | Ho, C. E.; Chen, C.; Kao, and C. R. | Journal of the Chinese Institute of Engineers | | | |
1999 | Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system | Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R. | Materials Transactions, JIM | | | |
1999 | Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering | Ho, C. E.; Chen, Y. M.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering | Ho, C. E.; Tsai, S. Y.; Kao, and C. R. | IEEE Transactions on Advanced Packaging | | | |
2002 | Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages | Shiau, L. C.; Ho, C. E.; Kao, and C. R. | Soldering and Surface Mount Technology | | | |
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Journal of Electronic Materials | | | |
2001 | Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder | Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R. | Chemistry of Materials | | | |
2005 | Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations | Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. | Materials Science and Engineering A | | | |
2004 | The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction | Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R. | TMS Letters | | | |