公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1995 | Application of thermodynamic kinetic data in the analysis of reactions in Pb-In/Cu ternary diffusion couples | Kao, C. R.; Bolcavage, A.; Chang, Y. A. | | | | |
1997 | Calculation of low-temperature phase equilibria in the indium-lead system | Kao, C. R. | Journal of the Chinese Institute of Engineers | | | |
1995 | Diffusional behavior in B2 intermetallic compounds | Kao, C. R.; Kim, S.; Chang, and Y. A. | Materials Science and Engineering | | | |
2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. | Journal of Materials Research | | | |
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 | | | |
1994 | Experimental determination of the Cu-In-Pb ternary phase diagram | Bolcavage, A.; Kao, C. R.; Chang, Y. A.; Romig, A. D. | | | | |
2007 | Interfacial reaction issues for lead-free electronic solders | Ho, C. E.; Yang, S. C.; Kao, C. R. | Journal of Materials Science: Materials in Electronics | | | |
2007 | Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element | Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R. | Journal of Applied Physics 101: | | | |
1996 | A mechanism for reactive diffusion between silicon single crystal and NbC powder compact | Kao, C. R.; Woodford, J.; Chang, and Y. A. | Journal of Materials Research | | | |
1997 | Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples | Kao, C. R. | Materials Science & Engineering | | | |
1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams,” CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry | Chen, S. L.; Zuo, Y.; Kao, C. R.; Chang, Y. A. | CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry | | | |
1996 | On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds | Kao, C. R. | Chinese Journal of Physics | | | |
1995 | On the site preference of ternary additions to triple defect B2 intermetallic compounds | Pike, L. M.; Kao, C. R.; Chen, S.-L.; Chang, Y. A. | | | | |
1993 | Phase equilibria of the Cu-In system I: experimental investigation | Bolcavage, A.; Chen, S. W.; Kao, C. R.; Chang, Y. A.; Romig, Jr A. D. | Journal of Phase Equilibria | | | |
1993 | Phase equilibria of the Cu-In system II: thermodynamic assessment and calculation of phase diagram | Kao, C. R.; Bolcavage, A.; Chen, S.-L.; Chen, S. W.; Chang, Y. A.; Romig, and A. D.; Jr | Journal of Phase Equilibria | | | |
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang, J. R.; Tsai, C. M.; Lin, Y. W.; Kao, C. R. | Journal of Materials Research | | | |
1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi, A.; Kao, C. R.; Chang, Y. A. | Scripta Materialia | | | |
1995 | Reactive diffusion between Si and NbC at 1300 oC | Kao, C. R.; Woodford, J.; Chang, and Y. A. | Acta Metallurgica Sinica | | | |
1995 | Reactive diffusion between silicon niobium carbide: application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao, C. R.; Woodford, J.; Chang, Y. A. | | | | |
2003 | Recent progress in phase diagram calculation and application | Kao, C. R. | JOM | | | |