公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure | Chiu, Y.S.; Kao, C.R.; Shigetou, A.; C. ROBERT KAO | Materials and Design | | 0 | |
2006 | Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration | Lin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R. | Journal of Electronic Materials | | | |
2008 | Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration | Lin, Y.L.; Lai, Y.S.; Lin, Y.W.; Kao, C.R. | Journal of Electronic Materials | | | |
2006 | In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing | Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R. | Journal of Electronic Materials | | | |
2020 | Phase stabilities and interfacial reactions of the Cu�VIn binary systems | Lin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | | 8 | |
2020 | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Sheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO | Journal of Materials Science: Materials in Electronics | | | |
2020 | Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs | Tsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | | | |
2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang, S.C.; Ho, C.E.; Chang, C.W.; Kao, C.R. | Journal of Materials Research | | | |
2008 | Tin Whisker Growth Induced by High Electron Current Density | Lin, Y.W.; Lai, Yi-shao; Lin, Y.L.; Tu, Chun-Te; Kao, C.R. | Journal of Electronic Materials | | | |
2020 | Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish | Weng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO | Journal of Electronic Materials | | 5 | |