公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2024 | Adamantane-based low-dielectric-constant photocurable resin for 3D printing electronics | You, Jhu Lin; Liu, I. Tseng; Chen, Yu Ho; Balaji, Ramachandran; SHIH-HUANG TUNG ; YING-CHIH LIAO | Additive Manufacturing | |||
2024 | Corrosion Under Insulation for Hot Structural Components | Liu, I. Tseng; Weng, Yi Chen; YING-CHIH LIAO | Engineering Materials | |||
2024 | Sustainable Super-Insulating Packaging Composite from Recycled Wood | Liu, I. Tseng; You, Jhu Lin; SHIH-HUANG TUNG ; YING-CHIH LIAO | Advanced Sustainable Systems |