公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | A novel noise mitigation design for TSV-to-device coupling using power distribution network | C.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems | 0 | 0 | |
2014 | Artificial neural network modeling for extrinsic capacitance of FinFET | W.-C. Chen; C.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems | 0 | 0 |