公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2009 | A new isolation structure for crosstalk reduction for pogo pins in a test socket | R.-B. Sun; C.-Y. Wen; Y.-C. Chang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | 5 | 0 | |
2011 | A new isolation structure of pogo pins for crosstalk reduction in a test socket | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 12 | 11 | |
2010 | Compromise impedance match design for pogo pins with different single-ended and differential signal-ground patterns | R.-B. Sun; R.-B. Wu; S.-W. Hsiao; D. De Zutter; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 12 | 7 | |
2009 | Compromised impedance match design for signal integrity of pogo pins structures with different signal-ground patterns | R.-B. Sun; R.-B. Wu; S.-W. Haiso; RUEY-BEEI WU | 13th IEEE Workshop on Signal Propagation on Interconnects | 9 | 0 | |
2008 | Designs of signal-ground bump-patterns for minimizing the simultaneous switching noise in a ball grid array | R.-B. Sun; C.-M. Lin; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 | |
2011 | Passive equalizer design for through silicon vias with perfect compensation | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 20 | 16 | |
2010 | RC passive equalizer for through silicon via | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 4 | 0 |