公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2012 | A compact analytic model of the strain field induced by through silicon vias | CHEE-WEE LIU ; Jan, S.-R.; Chou, T.-P.; Yeh, C.-Y.; Liu, C.W.; Goldstein, R.V.; Gorodtsov, V.A.; Shushpannikov, P.S.; CHEE-WEE LIU | IEEE Transactions on Electron Devices | | | |
2013 | Modeling and optimization of edge dislocation stressors | CHEE-WEE LIU ; Tsai, M.-H.; Jan, S.-R.; Yeh, C.-Y.; Liu, C.W.; Goldstein, R.V.; Gorodtsov, V.A.; Shushpannikov, P.S.; CHEE-WEE LIU | IEEE Electron Device Letters | | | |
2015 | Reply to 'comment on 'A compact analytic model of the strain field induced by through ilicon vias'' | CHEE-WEE LIU ; Jan, S.-R.; Chou, T.-P.; Yeh, C.-Y.; Liu, C.W.; Goldstein, R.V.; Gorodtsov, V.A.; Shushpannikov, P.S.; CHEE-WEE LIU | IEEE Transactions on Electron Devices | | | |