公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2003 | 3D electromagnetic modeling of polarization-dependent coupling characteristics of 1x3 linear array weakly fused fiber couplers | T.-L. Wu; C.-H. Chao; TZONG-LIN WU | Fiber and Integrated Optics | 0 | 0 | |
2011 | A broadband and miniaturized balun on system-in-package (SiP) | C.-H. Tsai; H.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE IMPAC | 1 | 0 | |
2010 | A broadband and miniaturized common-mode filter for gigahertz differential signals based on negative permittivity metamaterials | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 142 | 126 | |
2010 | A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits | H.-H. Chuang; C.-J. Hsu; J. Hong; C.-H. Yu; A. Cheng; J. Ku; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 5 | 3 | |
2013 | A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels | J.-C. Yen; S.-K. Hsu; T.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 15 | 13 | |
2012 | A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP | H.-C. Chen; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 32 | 27 | |
2015 | A Compact Dual-Band Common-Mode Filtering Component for EMC in Wireless Communication | C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | 1 | 0 | |
2014 | A Compact Loop-Slot Mode Combination Antenna for Ultra-thin Tablet Computer with Metallic Bottom Cover | J.-H. Chou; J.-F. Chang; D.-B Lin; H.-J. Li; T.-L. Wu; TZONG-LIN WU | IEEE Antennas and Wireless Propagation Letters | 22 | 18 | |
2009 | A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | |||
2006 | A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module | T.-L. Wu; M.-C. Lin; C.-W. Lin; W.-S. Jou; T.-T. Shih; W.-H. Cheng; TZONG-LIN WU | Journal of Lightwave Technology | 2 | 2 | |
2004 | A high shielding effectiveness plastic package for 2.5Gbps optical transceiver module | T.-L. Wu; W.-S. Jou; W.-C. Hung; C.-H. Lee; C.-W. Lin; W.-H. Cheng; TZONG-LIN WU | Electronics Letters | 4 | 3 | |
2004 | A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding | T.-L. Wu; W.-C. Hung; C.-H. Lee; C.-W. Lin; W.-S. Jou; W.-H. Cheng; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 2 | ||
2013 | A magnetic-field resonant probe with enhanced sensitivity for RF interference applications | H.-H. Chuang; G.-H. Li; E. Song; H.-H. Park; H.-T. Jang; H.-B. Park; Y.-J. Zhang; D. Pommerenke; T.-L. Wu; J. Fan; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 50 | 44 | |
2009 | A metamaterial-typed differential transmission line with broadband common-mode suppression | C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. Eur. Workshop | 10 | 0 | |
2011 | A miniaturized and broadband balun using artificial coupled line with imaginary even-mode impedance | C.-H. Tsai; I.-I. A. Ieong; H.-C. Chen; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 6 | 5 | |
2005 | A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure | H.-J. Ou; T.-S. Horng; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Applications Compat. | |||
2010 | A new bandastop filter uisng artificial defected ground structures with | Y.-H. Hsu; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 0 | ||
2015 | A New Broadband Common-Mode Noise Absorption Circuit for High-Speed Differential Digital Systems | C.-Y. Hsiao; C.-H. Cheng; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 57 | 53 | |
2004 | A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits | T.-K. Wang; C.-C. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Application Compat. | |||
2005 | A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards | T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 |