公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2002 | 3-D Thermal-ADI: a linear-time chip level transient thermal simulator | Ting-Yuan Wang; CHUNG-PING CHEN | IEEE Transactions on Computer-Aided Design of Integrated Circuits And Systems (TCAD) | |||
2003 | 3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator | Ting-Yuan Wang; Yu-Min Lee; CHUNG-PING CHEN | ACM International Symposium on Physical Design (ISPD) | |||
2002 | Optimization of the Power/Ground Network Wire-Sizing and Spacing Based on Sequential Network Simplex Algorithm | Ting-Yuan Wang; CHUNG-PING CHEN | 3rd International Symposium on Quality Electronic Design (ISQED) | |||
2004 | Power-Delivery Networks Optimization with Thermal Reliability Integrity | Ting-Yuan Wang; Jeng-Liang Tsai; |CHUNG-PING CHEN | ACM International Symposium on Physical Design (ISPD) | |||
2004 | SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis based on Model Reduction | Ting-Yuan Wang; CHUNG-PING CHEN | 5th International Symposium on Quality Electronic Design (ISQED) | |||
2004 | Thermal and Power Integrity based Power/Ground Networks Optimization | Ting-Yuan Wang; Jeng-Liang Tsai; CHUNG-PING CHEN | Design, Automation and Test in Europe Conference and Exhibition (DATE) | |||
2001 | Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method | Ting-Yuan Wang; CHUNG-PING CHEN | ACM International Symposium on Physical Design (ISPD) | |||
2003 | Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method | Ting-Yuan Wang; CHUNG-PING CHEN | IEEE Transaction on Very Large Scale Integration Systems (TVLSI) | 39 |