公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2006 | ARFID Tag Based Remote DNA Sensing System | Chien, J. H.; Tsai, J. Y.; Cheng, Y. T.; Yang, C. R.; Wang, P. Y.; Chang, T. L.; Lee, D. S.; Chang, C. W.; Chou, W. P.; Chiang, C. C.; Lee, Y. W. | IEEE NTC Review on Advances of Micro | | | |
2005 | Controlling the microstructure from the gold-tin Reaction | Tsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R. | Journal of Electronic Materials | | | |
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 | | | |
2004 | A New thermal cycling mechanism for Effective Polymerase Chain Reaction in Microliter Volumes | Lee, D. S.; Tsai, J. Y.; Yuan, W. H.; Chen, P. J.; Chen, P. H. | Microsystem Technologies 10: | | | |
2006 | A RFID Tag Based Remote DNA Sensing System | Chien, J. H.; Tsai, J. Y.; Cheng, Y. T.; Yang, C. R.; Wang, P. Y.; Chang, T. L.; Lee, D. S.; Chang, C. W.; Chou, W. P.; Chiang, C. C.; Chen, P. H. | IEEE NTC Review on Advances of Micro | | | |
2003 | A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni | Tsai, J. Y.; Hu, Y. C.; Tsai, C. M.; Kao, and C. R. | Journal of Electronic Materials | | | |