公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2007 | Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness | Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert | Journal of Electronic Materials | |||
2008 | Tin Whisker Growth Induced by High Electron Current Density | Lin, Y.W.; Lai, Yi-shao; Lin, Y.L.; Tu, Chun-Te; Kao, C.R. | Journal of Electronic Materials |