公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2009 | Flip-chip routing with unified area-I/O pad assignments for package-board co-design. | Fang, Jia-Wei; Wong, Martin D. F.; YAO-WEN CHANG | Proceedings - Design Automation Conference | |||
2009 | Thermal-driven analog placement considering device matching. | Lin, Mark Po-Hung; Zhang, Hongbo; Wong, Martin D. F.; YAO-WEN CHANG | Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009 |