公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2022 | Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection | YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
2022 | Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration | Kung, Po Yu; Huang, Wei Lun; Kao, Chin Li; YUNG-SHENG LIN; Hung, Yun Ching; C. ROBERT KAO | Materials | 1 | 0 |