Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2003 | An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating | Liu, R. S.; You, C. C.; Tsai, M. S.; Hu, S. F.; Li, Y. H.; Lu, C. P.; RU-SHI LIU | Solid State Communications | 11 | 12 |