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Issue DateTitleAuthor(s)SourcescopusWOSFulltext/Archive link
12006Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array packageChuang, Tung-Han ; Yen, Shiu-FangJournal of Electronic Materials 
22001AgIn2/Ag2In transformations in an In-49Sn/Ag soldered jointChuang, T. H.; Huang, Y. T.; Tsao, L. C.; ChuangTH Journal of Electronic Materials 
32005Controlling the microstructure from the gold-tin ReactionTsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R.Journal of Electronic Materials 
42007Cross-Interaction between Ni and Cu across Sn Layers with Different ThicknessChang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert Journal of Electronic Materials 
52004Cross-interaction of UBM and soldering pad in flip-chip solder jointsTsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R.Journal of Electronic Materials 
62002Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiHo, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R.Journal of Electronic Materials 
72006Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under ElectromigrationLin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R.Journal of Electronic Materials 
82004Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder jointsLin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R.Journal of Electronic Materials 
92018Effect of the Temperature Dependence of Transmissivity on the Thermal Boundary Conductance Between Two Dissimilar SolidsHuang M.-J. Journal of Electronic Materials 
102008Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under ElectromigrationLin, Y.L.; Lai, Y.S.; Lin, Y.W.; Kao, C.R.Journal of Electronic Materials 
112011Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder JointsChuang, Tung-Han ; Wu, Hsing-FeiJournal of Electronic Materials 
122010Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder JointsLin, Hsiu-Jen; Chuang, Tung-Han Journal of Electronic Materials 
132011Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu JointsLiu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; Kao, C.RobertJournal of electronic materials 
142010Effects of Ni Additions on the Growth of Cu3Sn in High-Lead SoldersWang, Y.W.; Chang, C.C.; Chen, W.M.; Kao, C.R.Journal of Electronic Materials 
152001Electromagnetic shielding of nylon-66 composites applied to laser modulesW.-S. Jou; T.-L. Wu; S.-K. Chiu; W.-H. Cheng; TZONG-LIN WU Journal of Electronic Materials 
162007Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper PadsLin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.Journal of Electronic Materials 
172005Electromigration induced failure in flip chip solder jointsLin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R.Journal of Electronic Materials 
182011Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current StressingTsai, M.Y.; Lin, Y.L.; Tsai, M.H.; Chen, Y.J.; Kao, C.R.Journal of ELECTRONIC MATERIALS 
192008Extraction of transport dynamics in AlGaN/GaN HFETs through free carrier absorptionWu, YR; Hinckley, JM; Singh, J; YUH-RENN WU Journal of Electronic Materials 
202000Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finishHo, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R.Journal of Electronic Materials