Results 1-315 of 315 (Search time: 0.01 seconds).

Issue DateTitleAuthor(s)SourcescopusWOSFulltext/Archive link
12022Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental CatalysisRenganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO Electroanalysis0
22022Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental CatalysisRenganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO Electroanalysis0
32022Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental CatalysisRenganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO Electroanalysis0
42021A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and SnTsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO Intermetallics0
52021Numerical analysis of an electroless plating problem in gas–liquid two-phase flowWu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO Fluids0
62021White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO 2021 International Conference on Electronics Packaging, ICEP 20210
72021Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachmentTsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology1
82021Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological ApplicationsZhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials0
92021A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and SnTsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO Intermetallics0
102021Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological ApplicationsZhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials0
112021A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and SnTsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO Intermetallics0
122021White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO 2021 International Conference on Electronics Packaging, ICEP 20210
132021Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachmentTsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology1
142021Numerical analysis of an electroless plating problem in gas–liquid two-phase flowWu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO Fluids0
152021White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO 2021 International Conference on Electronics Packaging, ICEP 20210
162021Numerical analysis of an electroless plating problem in gas–liquid two-phase flowWu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO Fluids0
172021Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological ApplicationsZhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials0
182021Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachmentTsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology1
192021Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinoneMaheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO New Journal of Chemistry3
202021Highly uniform microfluidic electroless interconnections for chip stacking applicationsHung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO Electrochimica Acta2
212020Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-PillarsYu H.Y.; Yang T.H.; Chiu Y.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials03
222020The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistanceLiao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO IEEE Transactions on Electron Devices2
232020Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressureChiu, Y.S.; Kao, C.R.; Shigetou, A.; C. ROBERT KAO Materials and Design0
242020Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface FinishWeng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO Journal of Electronic Materials1
252020Phase stabilities and interfacial reactions of the Cu�VIn binary systemsLin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics2
262020Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICsTsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference0
272020Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structureSheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics2
282020Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishingHung H.T; Lee P.T; Tsai C.H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology2
292020The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technologyLu P.-Y; Li Y.-R; Yen C.-M; Hung H.-T; Kao C.-R; Pu W.-C; Chen C.-C.A; Lee M.-H; Liao M.-H.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference0
302020Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection StructureHung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT0
312020Foldable Kirigami Paper ElectronicsYang T.H; Hida H; Ichige D; Mizuno J; Robert Kao C; Shintake J.; C. ROBERT KAO Physica Status Solidi (A) Applications and Materials Science3
322020Interconnections of low-temperature solder and metallizationsWang Y; Kao C.R.; C. ROBERT KAO Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 20200
332019Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuitsWeng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO Scripta Materialia24
342019Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni MicrojointsYang T.H.; Yu H.Y.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials910
352019Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compressionWu J.Y.; Chiu Y.S.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Materials Science and Engineering A24
362019Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis InterfaceYang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO Scientific Reports65
372019Bonding of Copper Pillars Using Electroless Cu PlatingKao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2019 International Conference on Electronics Packaging00
382019Phase formation and microstructure evolution in Cu/In/Cu jointsChiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability411
392019A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation ProcessYang T.H.; Yang C.Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO 2019 International Conference on Electronics Packaging10
402019Low temperature and pressureless microfluidic electroless bonding process for vertical interconnectionsHung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference00
412019Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using NanoindentationChiang P.J.; Wu J.Y.; Yu H.Y.; Kao C.R.; C. ROBERT KAO JOM05
422019Refine microstructure of solder materials via minor element additionsChung C.K.; Yu J.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO 13th Electronic Circuits World Convention: Connecting the World0
432019Effect of Ag concentration on small solder volume Ni/SnAg/Ni systemYu J.J.; Yang S.; Chung C.K.; Kao C.R.; C. ROBERT KAO 13th Electronic Circuits World Convention: Connecting the World0
442019Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couplesWang Y.W.; Zhu Z.X.; Shih W.L.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds03
452019Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applicationsWu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO Electronic Components and Technology Conference00
462019Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking ApplicationsWang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials34
472019A single bonding process for diverse organic-inorganic integration in IoT devicesYang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference00
482019Interfacial reactions of cu and in for low-temperature processesWang, Y.-W.; Kao, C.R.; C. ROBERT KAO 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 20190
492019Micropillar mechanics of Sn-based intermetallic compoundsYu, J.J.; Wu, J.Y.; Yu, L.J.; Kao, C.R.; C. ROBERT KAO Handbook of Mechanics of Materials0
502019Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D IntegrationShigetou, A.; Yang, T.H.; Kao, C.R.; C. ROBERT KAO IEEE 2019 International 3D Systems Integration Conference, 3DIC 20190
512018Materials merging mechanism of microfluidic electroless interconnection processYang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Journal of the Electrochemical Society49
522018Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiationYang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference30
532018Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentationChiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference00
542018Analyses and design for electrochemical migration suppression by alloying indium into silverYang C.A.; Wu J.; Lee C.C.; Kao C.R.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics25
552018Bonding of copper pillars using electroless Au platingWeng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference20
562018Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applicationsWang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds512
572018Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid InterdiffusionChiu Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference00
582018Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection ProcessYang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference00
592018Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indiumYang C.A.; Yang S.; Liu X.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1018
602018High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applicationsYang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO Electronic Components and Technology Conference20
612018Effects of plating conditions on electroless Ni-P plating in the microchannelYang C.-Y; Hung H.-T; Robert Kao C.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 20180
622017Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applicationsYu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; Kao C.R.; C. ROBERT KAO Materials Science and Engineering A79
632017Contacts for PbTeLi C.-C.; Kao C.R.; C. ROBERT KAO Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems10
642017Grain Boundary Penetration of Various Types of Ni Layer by Molten MetalsYang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials00
652017Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni PlatingHung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials79
662017Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentationYu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Science55
672017Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid IntegrationYang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO Langmuir55
682017Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro jointsYang H.W.; Wu J.Y.; Zhu Z.X.; Kao C.R.; C. ROBERT KAO Materials Chemistry and Physics1518
692017Critical Factors Affecting Structural Transformations in 3D IC Micro JointsYang H.W.; Yu H.Y.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference40
702017Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver JointYang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO Electronic Components and Technology Conference60
712016Full intermetallic joints for chip stacking by using thermal gradient bondingYang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; Kao C.R.; C. ROBERT KAO Acta Materialia2640
722016Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni platingYang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO International Microsystems, Packaging, Assembly, and Circuits Technology Conference60
732016Study of Sintered Nano-Silver Die Attachment Materials Doped with IndiumYang C.A.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference50
742016Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation studyKe J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO Acta Materialia67
752016Novel Self-shrinking Mask for Sub-3 nm Pattern FabricationYang P.-S.; Cheng P.-H.; Kao C.R.; Chen M.-J.; C. ROBERT KAO Scientific Reports54
762016Morphological evolution induced by volume shrinkage in micro jointsYang H.W.; Kao C.R.; C. ROBERT KAO 2016 International Conference on Electronics Packaging10
772016Bonding of copper pillars using electroless Ni platingYang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO 2016 International Conference on Electronics Packaging30
782016Choice of Intermetallic Compounds for Structural Applications in Near Submicron JointsYu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference10
792016Au-Sn bonding material for the assembly of power integrated circuit moduleZhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds5571
802015Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigrationYang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds3535
812015Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic JointsYang T.-L.; Zhu Z.-X.; Yu J.-J.; Lin Y.-F.; Kao C.R.; C. ROBERT KAO Advanced Engineering Materials23
822015Mechanism of volume shrinkage during reaction between Ni and Ag-doped SnLi C.C.; Ke J.H.; Yang C.A.; Kao C.R.; C. ROBERT KAO Materials Letters1217
832015Low temperature bonding for high temperature applications by using SnBi soldersYang T.L.; Wu J.Y.; Li C.C.; Yang S.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds3439
842015Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materialsLi C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Journal of Materials Chemistry C2126
852015Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applicationsYu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds2026
862015Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux dopingBashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; Kao C.R.; C. ROBERT KAO Journal of Materials Science3434
872015In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro jointsYu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference20
882015Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinementYu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference10
892015Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressingLi C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Energy Conversion and Management1417
902015Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID techniqueLi C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Electronic Components and Technology Conference10
912014Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni jointsLi C.C.; Chung C.K.; Shih W.L.; Kao C.R.; C. ROBERT KAO Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science1822
922014Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During ReflowKey Chung C.; Zhu Z.X.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials12
932014Phase field microelasticity model of dislocation climb: Methodology and applicationsKe J.H.; Boyne A.; Wang Y.; Kao C.R.; C. ROBERT KAO Acta Materialia1315
942014Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layerYang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; Kao C.R.; C. ROBERT KAO Solar Energy Materials and Solar Cells2328
952014Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressingHuang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; Kao C.R.; C. ROBERT KAO Scripta Materialia4449
962014Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminalsLi C.C.; Shih W.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO Corrosion Science35
972014Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuitsShih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials78
982014Effects of silver addition on Cu-Sn microjoints for chip-stacking applicationsYang T.L.; Yu J.J.; Shih W.L.; Hsueh C.H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds2634
992014Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applicationsYang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference40
1002014Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni JointsLi, C. C.; Chung, C. K.; Shih, W. L.; Kao, C. R.; C. ROBERT KAO Metallurgical and Materials Transactions A1821
1012013Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering processChung C.K.; Chen Y.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials97
1022013Cu(TiWNx) film as a barrierless buffer layer for metallization applicationsLin C.-H.; Chuang H.-Y.; Kao C.R.; C. ROBERT KAO Japanese Journal of Applied Physics77
1032013Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallicsChen Y.J.; Chung C.K.; Yang C.R.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability3843
1042013Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnectionsChen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; Kao C.R.; C. ROBERT KAO Materials Letters1213
1052013Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bondingLi C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; Kao C.R.; C. ROBERT KAO Science and Technology of Welding and Joining67
1062013Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressingHuang T.C.; Yang T.L.; Ke J.H.; Li C.C.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1515
1072013Serrated cathode dissolution under high current density: Morphology and root causeYang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Journal of Applied Physics66
1082013Volume shrinkage induced by interfacial reactions in micro jointsLi C.C.; Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials10
1092013Interfacial reactions and electromigration in flip-chip solder jointsHo C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO Advanced Flip Chip Packaging30
1102013Reliability of micro-interconnects in 3D IC packagesRobert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao; C. ROBERT KAO Microelectronics Reliability87
1112013Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressingHuang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; Kao, C.R.; C. ROBERT KAO Journal of Alloys and Compounds1515
1122013Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressingHuang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; Kao, C.R.; C. ROBERT KAO Journal of Alloys and Compounds1515
1132013Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applicationsYu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials10
1142013Grain refinement of solder materials by minor element additionChung C.K.; Yu J.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO International Microsystems, Packaging, Assembly, and Circuits Technology Conference50
1152013Au and Pd embrittlement in space-confined soldering reactions for 3D IC applicationsChen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials50
1162012Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-AuKey Chung C.; Huang T.C.; Shia R.; Yang T.L.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds48
1172012Elimination of voids in reactions between Ni and Sn: A novel effect of silverChuang H.Y.; Yu J.J.; Kuo M.S.; Tong H.M.; Kao C.R.; C. ROBERT KAO Scripta Materialia6271
1182012Critical concerns in soldering reactions arising from space confinement in 3-D IC packagesChuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; Kao C.R.; C. ROBERT KAO IEEE Transactions on Device and Materials Reliability6563
1192012The critical oxide thickness for Pb-free reflow soldering on Cu substrateChung C.K.; Chen Y.J.; Li C.C.; Kao C.R.; C. ROBERT KAO Thin Solid Films1822
1202012Origin and evolution of voids in electroless Ni during soldering reactionChung C.K.; Chen Y.J.; Chen W.M.; Kao C.R.; C. ROBERT KAO Acta Materialia2528
1212012Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titaniumChen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference20
1222012Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressingKe J.H.; Chuang H.Y.; Shih W.L.; Kao C.R.; C. ROBERT KAO Acta Materialia5960
1232012Effects of Ti addition to Sn-Ag and Sn-Cu soldersChen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds6667
1242012Soldering reactions under space confinement for 3D IC applicationsKao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO Electronic Components and Technology Conference40
1252011Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solderChang C.C.; Yang S.C.; Chen Y.J.; Kao C.R.; C. ROBERT KAO International Journal of Materials Research01
1262011Effects of joining sequence on the interfacial reactions and substrate dissolution behaviors in Ni/solder/Cu jointsLiu C.S.; Ho C.E.; Peng C.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2723
1272011Laminar pattern induced by cycling thermomechanical stress in two-phase materialsChang C.C.; Chen Y.J.; Tsai M.Y.; Kao C.R.; C. ROBERT KAO Materials Chemistry and Physics00
1282011Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressingKe J.H.; Yang T.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Acta Materialia4748
1292011Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bondingChen J.; Lai Y.-S.; Wang Y.-W.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability3638
1302011The orientation relationship between Ni and Cu6Sn5 formed during the soldering reactionChen W.M.; Yang T.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO Scripta Materialia2526
1312011Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packagingChuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference130
1322011Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bondingLu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference420
1332011Experimental evidence for formation of Ni-Al compound in flip-chip joints under current stressingTsai M.Y.; Lin Y.L.; Tsai M.H.; Chen Y.J.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials11
1342010Novel Cu-RuNx composite layer with good solderability and very low consumption rateChuang H.Y.; Lin C.H.; Chu J.P.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1010
1352010Oxidation behavior of ENIG and ENEPIG surface finishLee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference20
1362010Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volumeChang C.C.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1372010Effects of Ni additions on the growth of Cu 3Sn in high-lead soldersWang Y.W.; Chang C.C.; Chen W.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials66
1382010Uncovering the driving force for massive spalling in the Sn-Cu/Ni systemChen W.M.; Yang S.C.; Tsai M.H.; Kao C.R.; C. ROBERT KAO Scripta Materialia2321
1392010Interaction between Ni and Cu across 95Pb-5Sn high-lead layerChang C.C.; Chung H.Y.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials97
1402010Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and NiYang S.C.; Chang C.C.; Tsai M.H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds3937
1412010Transmission electron microscopy characterization of Ni(V) metallization stressed under high current density in flip chip solder jointsTsai M.Y.; Lin Y.L.; Lin Y.W.; Ke J.H.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials22
1422010Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systemsTsai M.Y.; Yang S.C.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds2224
1432010Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactionsTsai M.H.; Chen W.M.; Tsai M.Y.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1312
1442010Direct evidence for a Cu-enriched region at the boundary between Cu 6Sn5 and Cu3Sn during Cu/Sn reactionChung C.K.; Duh J.-G.; Kao C.R.; C. ROBERT KAO Scripta Materialia3341
1452010Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to soldersWang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds4234
1462010Interfacial reaction between 95Pb-5Sn solder bump and 37Pb-63Sn presolder in flip-chip solder jointsChang C.C.; Wang Y.W.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials87
1472010Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature controlYang T.L.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1482010Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrateChen W.M.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1492010Temperature effects on electromigration behavior of solder jointsKe J.-H.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference20
1502010The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow solderingChang C.C.; Lin Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds7776
1512010Electromigration in flip chip solder joints under extra high current densityLin Y.W.; Ke J.H.; Chuang H.Y.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Journal of Applied Physics1922
1522010Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead LayerChang, C. C.; Chung, H. Y.; Lai, Y. S.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials97
1532010Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder JointsTsai, M. Y.; Lin, Y. L.; Lin, Y. W.; Ke, J. H.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials22
1542010Novel Cu-RuNx composite layer with good solderability and very low consumption rateChuang, H. Y.; Lin, C. H.; Chu, J. P.; Kao, C. R.; C. ROBERT KAO Journal of Alloys and Compounds1010
1552010Effects of Ni Additions on the Growth of Cu3Sn in High-Lead SoldersWang, Y. W.; Chang, C. C.; Chen, W. M.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials66
1562010Novel Cu-RuN<inf>x</inf> composite layer with good solderability and very low consumption rateChuang, H.Y.; Lin, C.H.; Chu, J.P.; Kao, C.R.; C. ROBERT KAO Journal of Alloys and Compounds1010
1572009Journal of Electronic Materials: ForewordKang S.K.; Anderson I.; Chada S.; Duh J.-G.; Turbini L.J.; Wu A.; Kao C.R.; Hua F.; Subramanian K.N.; Frear D.; Handwerker C.; Guo F.; Chawla N.; Zeng K.; C. ROBERT KAO Journal of Electronic Materials20
1582009Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder jointsTsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference00
1592009Effect of multiple reflow cycles on ball impact responses of SnAgCu solder jointsLai Y.; Chang H.; Kao C.; Kao C.R.; C. ROBERT KAO Soldering & Surface Mount Technology02
1602009Interfacial reaction and the dominant diffusing species in Mg-Ni systemTsai M.Y.; Chou M.H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1716
1612009Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrateTsai M.H.; Lin Y.W.; Chuang H.Y.; Kao C.R.; C. ROBERT KAO Journal of Materials Research99
1622009Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substratesChang C.C.; Lin Y.W.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials65
1632009Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substratesWang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability7475
1642009Interfacial reaction and wetting behavior between Pt and molten solderYang S.C.; Chang W.C.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials1216
1652009Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow solderingChang C.-C.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference10
1662009Development of lead-free solders with superior drop test reliability performanceWang Y.W.; Kao C.R.; C. ROBERT KAO 2009 International Conference on Electronic Packaging Technology and High Density Packaging30
1672009Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and CuWang Y.W.; Lin Y.W.; Tu C.T.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds139139
1682009Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSnChang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference00
1692009Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voidsWang Y.W.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference00
1702009Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growthWang Y.W.; Chang C.C.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds8078
1712009Special Issue: 2009 Pb-Free Solders - ForewordKang, Sung K.; Anderson, Iver; Chada, Srini; Duh, Jeng-Gong; Turbini, Laura J.; Wu, Albert; Kao, C. Robert; Hua, Fay; Subramanian, K. N.; Frear, Darrel; Handwerker, Carol; Guo, Fu; Chawla, Nik; Zeng, Kejun; C. ROBERT KAO Journal of Electronic Materials20
1722009Interfacial Reaction and Wetting Behavior Between Pt and Molten SolderYang, S. C.; Chang, W. C.; Wang, Y. W.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials1216
1732009Journal of Electronic Materials: ForewordKang, S.K.; Anderson, I.; Chada, S.; Duh, J.-G.; Turbini, L.J.; Wu, A.; Kao, C.R.; Hua, F.; Subramanian, K.N.; Frear, D.; Handwerker, C.; Guo, F.; Chawla, N.; Zeng, K.; C. ROBERT KAO Journal of Electronic Materials20
1742009Minimum effective Ni addition to SnAgCu solders for retarding Cu<inf>3</inf>Sn growthWang, Y.W.; Chang, C.C.; Kao, C.R.; C. ROBERT KAO Journal of Alloys and Compounds8078
1752009Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growthWang, Y. W.; Chang, C. C.; Kao, C. R.; C. ROBERT KAO Journal of Alloys and Compounds8079
1762008電遷移對覆晶元件銲點之影響(3/3)高振宏 
1772008物質跨越微電子銲點進行交互作用之尖端研究 (新制多年期第1年)高振宏 
1782008物質跨越微電子銲點進行交互作用之尖端研究 (新制多年期第2年)高振宏 
1792008Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growthWang Y.W.; Kao C.R.; C. ROBERT KAO 2008 10th International Conference on Electronic Materials and Packaging20
1802008Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finishLail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference10
1812008Microstructure study of high lead bump FCBGA bending testHung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1822008Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cuYang S.C.; Wang Y.W.; Chang C.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials1718
1832008Pronounced electromigration of Cu in molten Sn-based soldersHuang J.R.; Tsai C.M.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Research4347
1842008Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigrationLin Y.L.; Lai Y.S.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2117
1852008Tin whisker growth induced by high electron current densityLin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2328
1862008Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technologyKao, C.R.; C. ROBERT KAO JOM00
1872008Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New TechnologyKao, C. Robert JOM 
1882007Role of minor Zn addition in the interfacial reaction between lead-free solders and CuYang S.C.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1892007The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interfaceWang Y.W.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference50
1902007Effect of Zn addition on the interfacial reactions between Cu and lead-free soldersYang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO Materials Research Society Symposium1
1912007Tin whisker growth induced by high electron current densityLin Y.W.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1922007Interfacial reaction issues for lead-free electronic soldersHo C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics180
1932007Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active elementYang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Applied Physics4443
1942007Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systemsYang S.C.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference20
1952007Dissolution and interfacial reaction between Cu and Sn-Ag-Cu soldersChang C.C.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference60
1962007Massive spalling of intermetallic compound in lead-free solder jointsYang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO Materials Research Society Symposium0
1972007Interfacial reaction issues for lead-free electronic soldersHo C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics263264
1982007Cross-interaction between Ni and Cu across Sn layers with different thicknessChang, C.W.; Yang, S.C.; Tu, C.-T.; Kao, C.R.; C. ROBERT KAO Journal of Electronic Materials5448
1992007Cross-Interaction between Ni and Cu across Sn Layers with Different ThicknessChang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert Journal of Electronic Materials 
2002006化學工程與材料工程高振宏 化工技術 
2012006SnAgCu系列無鉛銲料應用於先進微電子封裝之研究高振宏 ; 楊素純工程科技通訊 
2022006Strong Zn concentration effect on the soldering reactions between Sn-based solders and CuYang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Research8682
2032006Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder jointsLin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials4142
2042006Effects of limited Cu supply on soldering reactions between SnAgCu and NiHo C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; Jiang D.S.; C. ROBERT KAO Journal of Electronic Materials126109
2052006Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couplesChang C.W.; Lee Q.P.; Ho C.E.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2122
2062006Journal of Electronic Materials: ForewordSuganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; Chada S.; C. ROBERT KAO Journal of Electronic Materials00
2072006Journal of Electronic Materials: ForewordChawla N.; Chada S.; Kang S.K.; Kao C.R.; Lin K.-L.; Lucas J.; Turbini L.; C. ROBERT KAO Journal of Electronic Materials20
2082006In-situ observation of material migration in flip-chip solder joints under current stressingTsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials99
2092006Local melting induced by electromigration in flip-chip solder jointsTsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials5151
2102006Microstructure evolution of gold-tin eutectic solder on Cu and Ni substratesTsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials3434
2112006Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigrationLin Y.L.; Lai Y.S.; Tsai C.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2927
2122006Kinetics of AuSn 4 migration in lead-free soldersChang C.W.; Ho C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2119
2132006Lead-free solder implementation: Reliability, alloy development, new technology - ForewordChawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura; C. ROBERT KAO Journal of Electronic Materials20
2142006Microstructure evolution of gold-tin eutectic solder on Cu and Ni substratesTsai, J. Y.; Chang, C. W.; Ho, C. E.; Lin, Y. L.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials3434
2152006Special issue papers: Phase stability, phase transformations, and reactive phase formation in electronics materials IV - ForewordChen, S. W.; Kao, C. R.; Lee, H. M.; Mohney, S.; Suganuma, K.; Swenson, D. J.; Chada, S.; C. ROBERT KAO Journal of Electronic Materials41
2162006Effects of limited Cu supply on soldering reactions between SnAgCu and NiHo, C. E.; Lin, Y. W.; Yang, S. C.; Kao, C. R.; Jiang, D. S.; C. ROBERT KAO Journal of Electronic Materials126109
2172006Kinetics of AuSn4 migration in lead-free soldersChang, C. W.; Ho, C. E.; Yang, S. C.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials2119
2182006Special issue papers: Phase stability, phase transformation, and reactive phase formation in electronic materials V - ForewordSuganuma, Katsuaki; Chen, Sinn-wen; Kao, C. Robert; Lee, Hyuck Mo; Swenson, Douglas J.; Chada, Srinivas; C. ROBERT KAO Journal of Electronic Materials00
2192006Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigrationLin, Y. L.; Lai, Y. S.; Tsai, C. M.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials2927
2202006Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couplesChang, C. W.; Lee, Q. P.; Ho, C. E.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials2122
2212006Local melting induced by electromigration in flip-chip solder jointsTsai, C. M.; Lin, Y. L.; Tsai, J. Y.; Lai, Yi-Shao; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials5151
2222006Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder jointsLin, Y. L.; Chang, C. W.; Tsai, C. M.; Lee, C. W.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials4142
2232006Journal of Electronic Materials: ForewordChawla, N.; Chada, S.; Kang, S.K.; Kao, C.R.; Lin, K.-L.; Lucas, J.; Turbini, L.; C. ROBERT KAO Journal of Electronic Materials20
2242005Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrationsLuo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Materials Science and Engineering A109101
2252005Electromigration-induced grain rotation in anisotropic conducting beta tinWu A.T.; Gusak A.M.; Tu K.N.; Kao C.R.; C. ROBERT KAO Applied Physics Letters6964
2262005Volume effect on the soldering reaction between SnAgCu solders and NiHo C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces290
2272005Electromigration-induced failure in flip-chip solder jointsLin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials8684
2282005Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigrattonWu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO Materials Research Society Symposium4
2292005Controlling the microstructures from the gold-tin reactionTsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials9080
2302005In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressingLin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO Acta Materialia141134
2312005Electromigration induced metal dissolution in flip-chip solder jointsLin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO Materials Science Forum4
2322005Electromigration induced metal dissolution in flip-chip solder jointsLin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-54
2332004先進微電子封裝中錫銀銅銲料與金/鎳 表面處理層之界面反應羅偉誠 ; 蕭麗娟; 何政恩; 高振宏 Journal of the Chinese Colloid & Interface Science 
2342004Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder jointsTsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials5855
2352004Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffractionWu A.T.; Tu K.N.; Lloyd J.R.; Tamura N.; Valek B.C.; Kao C.R.; C. ROBERT KAO Applied Physics Letters5751
2362004Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder jointsLin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials1516
2372004Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder jointsLin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials1516
2382004Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder jointsTsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, C. R.; C. ROBERT KAO Journal of Electronic Materials5855
2392004Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - ForewordKao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. J.; C. ROBERT KAO Journal of Electronic Materials00
2402003SEM/EDS的原理與操作應用之簡介半導體工業構裝材料何政恩; 高振宏 化工技術 
2412003大學化工熱力學課程發展之回顧高振宏 化工 
2422003錫銀銅銲料與鎳層反應時銅濃度效應之探討羅偉誠 ; 胡應強; 何政恩; 高振宏 Welding and Cutting 
2432003純物質織成核熱力學及動力學簡介蔡家銘; 高振宏 化工技術 
2442003A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of NiTsai J.Y.; Hu Y.C.; Tsai C.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials140131
2452003ForewordChen S.-W.; Lee H.M.; Swenson D.; Kao C.R.; Mohney S.E.; Notis M.R.; Schmid-Fetzer R.; C. ROBERT KAO Journal of Electronic Materials00
2462003Chemical reaction in solder joints of microelectronic packagesHo C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Chemical Engineers7
2472003Electromigration failure in flip chip solder joints due to rapid dissolution of copperHu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO Journal of Materials Research120119
2482003Recent progress in phase diagram calculation and applicationKao C.R.; C. ROBERT KAO JOM00
2492003ForewordChen, S.-W.; Lee, H.M.; Swenson, D.; Kao, C.R.; Mohney, S.E.; Notis, M.R.; Schmid-Fetzer, R.; C. ROBERT KAO Journal of Electronic Materials00
2502003Recent progress in phase diagram calculation and applicationKao, C. R.; C. ROBERT KAO Jom-Journal of the Minerals Metals & Materials Society00
2512003Special issue on lead-free solders and processing issues in microelectronic packaging - ForewordLucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO Journal of Electronic Materials21
2522003Recent progress in phase diagram calculation and applicationKao, C.R.; C. ROBERT KAO JOM00
2532003Special issue on phase stability, phase transformations, and reactive phase formation in electronic materials - ForewordChen, S. W.; Lee, H. M.; Swenson, D.; Kao, C. R.; Mohney, S. E.; Notis, M. R.; Schmid-Fetzer, R.; C. ROBERT KAO Journal of Electronic Materials00
2542002構裝接點面面觀-鉍錫無鉛銲料系統胡應強; 陳琪; 徐敏雯; 高振宏 工業材料雜誌 
2552002抑制易脆之Au介金屬於微電子封裝銲點中生成之方法何政恩; 高振宏 知識創新 
2562002先進封裝技術中金脆效應對銲點影響之探討何政恩; 蕭麗娟; 高振宏 電子與材料 
2572002Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesShiau L.C.; Ho C.E.; Kao C.R.; C. ROBERT KAO Soldering and Surface Mount Technology107100
2582002The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallizationTsai J.Y.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging110
2592002Electromigration in tin thin filmHu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging20
2602002Phase diagrams of important electronic materialsKao C.R.; C. ROBERT KAO JOM55
2612002Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packagesLin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 200220
2622002Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finishLuo W.-C.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 2002130
2632002Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu soldersChen W.T.; Ho C.E.; Kao C.R.; C. ROBERT KAO Journal of Materials Research202190
2642002Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder jointsHo C.E.; Shiau L.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials6359
2652002Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and NiHo C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Chemistry of Materials7472
2662002New failure mode induced by electric current in flip chip solder jointLin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 200210
2672002ForewordChada S.; Frear D.; Jin S.; Kang S.K.; Kao C.R.; Weiser M.; C. ROBERT KAO Journal of Electronic Materials31
2682002Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiHo C.E.; Tsai R.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials294270
2692002ForewordChada, S.; Frear, D.; Jin, S.; Kang, S.K.; Kao, C.R.; Weiser, M.; C. ROBERT KAO Journal of Electronic Materials31
2702002Special issue on lead-free solders and materials issues in microelectronic packaging - ForewordChada, S.; Frear, D.; Jin, S. H.; Kang, S. K.; Kao, C. R.; Weiser, M.; C. ROBERT KAO Journal of Electronic Materials31
2712002Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesShiau, L. C.; Ho, C. E.; Kao, C. R.; C. ROBERT KAO Soldering & Surface Mount Technology107100
2722002Phase diagrams of important electronic materialsKao, C. R.; C. ROBERT KAO Jom-Journal of the Minerals Metals & Materials Society55
2732002Phase diagrams of important electronic materialsKao, C.R.; C. ROBERT KAO JOM55
2742001Selective interfacial reaction between Ni and eutectic BiSn lead-free solderTao W.H.; Chen C.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Chemistry of Materials5456
2752001Interactions between solder and metallization during long-term aging of advanced microelectronic packagesHo C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials5656
2762001ForewordKang S.K.; Mavoori H.; Chada S.; Kao C.R.; Smith R.W.; C. ROBERT KAO Journal of Electronic Materials106
2772001Reaction of solder with Ni/Au metallization for electronic packages during reflow solderingHo C.E.; Tsai S.Y.; Kao C.R.; C. ROBERT KAO IEEE Transactions on Advanced Packaging5445
2782001Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finishLiu C.M.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials6258
2792001Special issue on lead-free solder materials and soldering technologies - ForewordKang, S. K.; Mavoori, H.; Chada, S.; Kao, C. R.; Smith, R. W.; C. ROBERT KAO Journal of Electronic Materials106
2802001ForewordKang, S.K.; Mavoori, H.; Chada, S.; Kao, C.R.; Smith, R.W.; C. ROBERT KAO Journal of Electronic Materials106
2812000鎳與微電子用鉍錫銲料反應之研究高振宏 工程科技通訊 
2822000Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrateChen C.; Ho C.E.; Lin A.H.; Luo G.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials4750
2832000Optimizing the wire-bonding parameters for second bonds in ball grid array packagesHo C.E.; Chen C.; Kao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an00
2842000Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finishHo C.E.; Zheng R.; Luo G.L.; Lin A.H.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials123120
2852000Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixtureLee, L. S.; Lin, C. W.; Kao, C. H.; C. ROBERT KAO Industrial & Engineering Chemistry Research1516
2861999微電子用鉍錫銲料與銅反應之研究高振宏 工程科技通訊 
2871999熱力學與相圖之關係何政恩; 蕭本俐; 高振宏 化工 
2881999Binary compounds in the Ge-Ti systemJain T.A.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1111
2891999Reaction kinetics of solder-balls with pads in BGA packages during reflow solderingHo C.E.; Chen Y.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials8879
2901999Phase relation in the titanium-rich region of the Ge-Si-Ti ternary systemJain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO Materials Transactions63
2911999Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi systemLee S M.; Chen C.; Kao C.R.; C. ROBERT KAO Chemistry of Materials29
2921999Interfacial reactions between ni substrate and the component bi in soldersLee M.S.; Liu C.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2427
2931999Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallizationChen, C. P.; Lin, C. F.; Swenson, D.; Kao, C. R.; Jan, C. H.; Chang, Y. A.; C. ROBERT KAO Journal of Vacuum Science & Technology B02
2941998銲接在電子工業上的應用陳琪; 高振宏 Welding and Cutting 
2951998Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and TiJain T.A.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials44
2961997半導體工業構裝材料高振宏 ; 李明勳化工技術 
2971997Calculation of low-temperature phase equilibria in the indium-lead systemKao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an11
2981997Reactions of solid copper with pure liquid tin and liquid tin saturated with copperHayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Scripta Materialia6260
2991997Microstructures developed in solid-liquid reactions: Using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examplesKao C.R.; C. ROBERT KAO Materials Science and Engineering A6968
3001996On the site preferences of ternary additions to triple defect B2 intermetallic compoundsPike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO TMS Annual Meeting1
3011996Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide compositeKao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO TMS Annual Meeting1
3021996On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compoundsKao C.R.; C. ROBERT KAO Chinese Journal of Physics0
3031996A mechanism for reactive diffusion between Si single crystal and NbC powder compactKao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO Journal of Materials Research87
3041995A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defectsChen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Intermetallics2326
3051995Synthesis of in situ composites through solid-state reactions: thermodynamic, mass-balance and kinetic considerationsKao C.R.; Woodford J.; Kim S.; Zhang M.-X.; Chang Y.A.; C. ROBERT KAO Materials Science and Engineering A1616
3061995Diffusional behavior in B2 intermetallic compoundsKao C.R.; Kim S.; Chang Y.A.; C. ROBERT KAO Materials Science and Engineering A2723
3071994Site preference of substitutional additions to triple-defect B2 intermetallic compoundsKao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO Intermetallics4747
3081994Application of Thermodynamics, Phase-Equilibria and Kinetics to in-Situ Composite Synthesis Via Ternary Solid-State Displacement-ReactionsChang, Ya; Kao, Cr; C. ROBERT KAO Pure and Applied Chemistry1614
3091993Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagramKao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO Journal of Phase Equilibria270
3101993A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactionsKao C.R.; Chang Y.A.; C. ROBERT KAO Acta Metallurgica Et Materialia5250
3111993Phase equilibria of the cu-in system I: Experimental investigationBolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO Journal of Phase Equilibria530
3121993On the composition dependencies of self-diffusion coefficients in B2 intermetallic compoundsKao C.R.; Chang Y.A.; C. ROBERT KAO Intermetallics121108
3131993On the optimization of solution model parameter values of phases and the calculation of phase diagramsChen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Calphad89
3141990Model for micelle formation in copolymer/homopolymer blendsKao C.R.; De La Cruz M.O.; C. ROBERT KAO The Journal of Chemical Physics1314
3151988高階動態系統積分法則之開發與研究趙榮澄; 高振宏 ; 張志雄化工