Publications

Results 1-294 of 294 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)SourcescopusWOSFulltext/Archive link
12023Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless depositionShih, P. S.; Huang, C. H.; C. ROBERT KAO Journal of Alloys and Compounds0
22023Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion MillingChang, Fu Ling; Lin, Yu Hsin; Hung, Han Tang; Kao, Chen Wei; C. ROBERT KAO Materials00
32023Enhanced Reactivity of Electroless Cu Interconnection by Surface Oxidation PretreatmentLin, Y. C.; Shen, C. H.; Hung, C. Y.; Shih, P. S.; Huang, J. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; C. ROBERT KAO 2023 International Conference on Electronics Packaging, ICEP 2023
42023Investigation of the Stability of CuIn2in Cu-In Phase DiagramChang, F. L.; Lin, Y. H.; C. ROBERT KAO 2023 International Conference on Electronics Packaging, ICEP 2023
52023Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding ParametersTatsumi, Hiroaki; C. ROBERT KAO ; Nishikawa, Hiroshi2023 International Conference on Electronics Packaging, ICEP 2023
62023Enhanced Cu-to-Cu Bonding by Using Sn Passivation LayerKung, P. Y.; Huang, W. L.; Kao, C. L.; Hung, Y. C.; C. ROBERT KAO 2023 International Conference on Electronics Packaging, ICEP 2023
72023Interfacial Reaction between Silver and Solid IndiumFang, I. C.; Chang, F. L.; Chang, C. C.; C. ROBERT KAO 2023 International Conference on Electronics Packaging, ICEP 2023
82023Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module PackagingTsai, Chin Hao; Steiner, Felix; Ishikawa, Dai; C. ROBERT KAO ; Blank, Thomas2023 International Conference on Electronics Packaging, ICEP 2023
92023Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic SystemShih, Po Shao; Huang, Jeng Hau; Shen, Chang Hsien; Lin, Yu Chun; Grufner, Simon Johannes; Renganathan, Vengudusamy; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference
102023A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packagingHuang, Jeng Hau; Shih, Po Shao; Shen, Chang Hsien; Renganathan, Vengudusamy; Grafner, Simon Johannes; Lin, Yu Chun; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference
112022Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulationTatsumi, Hiroaki; C. ROBERT KAO ; Nishikawa, HiroshiScientific Reports10
122022Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-IntegrationKung, Po Yu; Huang, Wei Lun; Kao, Chin Li; YUNG-SHENG LIN; Hung, Yun Ching; C. ROBERT KAO Materials10
132022Periodic copper microbead array on silver layer for dual mode detection of glyphosateBalaji, Ramachandran; Renganathan, Vengudusamy; Chu, Chia Pei; YING-CHIH LIAO ; C. ROBERT KAO ; Chen, Shen MingOpenNano10
142022Flow in a microchannel filled with arrays of numerous pillarsGräfner, S. J.; Wu, P. Y.; C. ROBERT KAO International Journal of Heat and Fluid Flow2
152022Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-BumpsKao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; Huang, Wei Chen; Chang, Fu Ling; C. ROBERT KAO Materials22
162022Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu PlatingChen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; C. ROBERT KAO ; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D.Proceedings - Electronic Components and Technology Conference2
172022High-Temperature Reliability of Sintered Silver-Tin Alloy Paste for Die Attach ApplicationsHuang, Wei Chen; Tsai, Chin Hao; C. ROBERT KAO 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings0
182022Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulationGrafner, S. J.; Huang, J. H.; Chen, Y. A.; Shih, P. S.; Huang, C. H.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference3
192022A novel method of low temperature, pressureless interconnection for wafer level scale 3D packagingShih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference2
202022Formation Mechanism of high Ni content (Cu, Ni)6Sn5in Cu/Sn/Ni microbump for solid state agingYu, Haiyang; C. ROBERT KAO Proceedings of 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 20220
212022Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless InterconnectionYUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference2
222022Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion LayersKao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; C. ROBERT KAO 2022 International Conference on Electronics Packaging, ICEP 20220
232022Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interfaceHuang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference2
242022Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquatMaheshwaran S; Renganathan V; Chen S.-M; Balaji R; C. ROBERT KAO ; Chandrasekar N; Ethiraj S; Samuel M.S; Govarthanan M.Chemosphere1612
252022Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental CatalysisRenganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO Electroanalysis11
262022Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structureLee P.-T; Hsieh W.-Z; Lee C.-Y; Tseng S.-C; Tang M.-T; Chiang C.-Y; C. ROBERT KAO ; Ho C.-E.Scripta Materialia22
272022Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solutionHuang J.H; Shih P.S; Renganathan V; Grӓfner S.J; Chen Y.A; Huang C.H; Kao C.L; Lin Y.S; Hung Y.C; C. ROBERT KAO Electrochimica Acta61
282022Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor DevicesTsai C.-H; Huang W.-C; C. ROBERT KAO Materials42
292021White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO 2021 International Conference on Electronics Packaging, ICEP 202110
302021Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological ApplicationsZhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials00
312021Numerical analysis of an electroless plating problem in gas–liquid two-phase flowWu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO Fluids21
322021Highly uniform microfluidic electroless interconnections for chip stacking applicationsHung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO Electrochimica Acta1712
332021A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and SnTsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO Intermetallics44
342021Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachmentTsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology84
352021Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinoneMaheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO New Journal of Chemistry129
362020Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressureChiu, Y.S.; Kao, C.R.; Shigetou, A.; C. ROBERT KAO Materials and Design00
372020Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-PillarsYu H.Y.; Yang T.H.; Chiu Y.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials53
382020The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technologyLu, P.-Y.; Li, Y.-R.; Yen, C.-M.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference30
392020Phase stabilities and interfacial reactions of the Cu�VIn binary systemsLin, Y.F.; Hung, H.T.; Yu, H.Y.; Kao, C.R.; Wang, Y.W.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics74
402020Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection StructureHung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT10
412020Interconnections of low-temperature solder and metallizationsWang Y; Kao C.R.; C. ROBERT KAO Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 202010
422020Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICsTsai, C.-H.; Huang, W.-C.; Kao, C.R.; Chew, L.M.; Schmitt, W.; Nishikawa, H.; C. ROBERT KAO Proceedings - Electronic Components and Technology Conference30
432020The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistanceLiao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO ; WEI-JIUN SU ; C. ROBERT KAO IEEE Transactions on Electron Devices45
442020Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface FinishWeng, I.A.; Hung, H.T.; Huang, W.C.; Kao, C.R.; Chen, Y.H.; C. ROBERT KAO Journal of Electronic Materials63
452020Foldable Kirigami Paper ElectronicsYang T.H; Hida H; Ichige D; Mizuno J; Robert Kao C; Shintake J.; C. ROBERT KAO Physica Status Solidi (A) Applications and Materials Science57
462020Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structureSheikhi, R.; Huo, Y.; Tsai, C.-H.; Kao, C.R.; Shi, F.G.; Lee, C.C.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics75
472020Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishingHung H.T; Lee P.T; Tsai C.H; Kao C.R.; C. ROBERT KAO Journal of Materials Research and Technology76
482019Interfacial reactions of cu and in for low-temperature processesWang, Y.-W.; Kao, C.R.; C. ROBERT KAO 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 201920
492019Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applicationsWu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO Electronic Components and Technology Conference20
502019Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D IntegrationShigetou, A.; Yang, T.H.; Kao, C.R.; C. ROBERT KAO IEEE 2019 International 3D Systems Integration Conference, 3DIC 201900
512019A single bonding process for diverse organic-inorganic integration in IoT devicesYang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference00
522019Refine microstructure of solder materials via minor element additionsChung C.K.; Yu J.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO 13th Electronic Circuits World Convention: Connecting the World0
532019Low temperature and pressureless microfluidic electroless bonding process for vertical interconnectionsHung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference40
542019Effect of Ag concentration on small solder volume Ni/SnAg/Ni systemYu J.J.; Yang S.; Chung C.K.; Kao C.R.; C. ROBERT KAO 13th Electronic Circuits World Convention: Connecting the World0
552019Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using NanoindentationChiang P.J.; Wu J.Y.; Yu H.Y.; Kao C.R.; C. ROBERT KAO JOM77
562019Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis InterfaceYang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO Scientific Reports86
572019Bonding of Copper Pillars Using Electroless Cu PlatingKao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2019 International Conference on Electronics Packaging70
582019Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni MicrojointsYang T.H.; Yu H.Y.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials1110
592019A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation ProcessYang T.H.; Yang C.Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO 2019 International Conference on Electronics Packaging30
602019Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compressionWu J.Y.; Chiu Y.S.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Materials Science and Engineering A99
612019Micropillar mechanics of Sn-based intermetallic compoundsYu, J.J.; Wu, J.Y.; Yu, L.J.; Kao, C.R.; C. ROBERT KAO Handbook of Mechanics of Materials20
622019Phase formation and microstructure evolution in Cu/In/Cu jointsChiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability1413
632019Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking ApplicationsWang Y.W.; Shih W.L.; Hung H.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials86
642019Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couplesWang Y.W.; Zhu Z.X.; Shih W.L.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds66
652019Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuitsWeng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO Scripta Materialia129
662018Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection ProcessYang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference60
672018Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentationChiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference00
682018Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid InterdiffusionChiu Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference20
692018Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indiumYang C.A.; Yang S.; Liu X.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds2420
702018Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiationYang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference30
712018Analyses and design for electrochemical migration suppression by alloying indium into silverYang C.A.; Wu J.; Lee C.C.; Kao C.R.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics910
722018High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applicationsYang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO Electronic Components and Technology Conference80
732018Bonding of copper pillars using electroless Au platingWeng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference50
742018Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applicationsWang Y.W.; Yang T.L.; Wu J.Y.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1413
752018Materials merging mechanism of microfluidic electroless interconnection processYang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; Kao C.R.; C. ROBERT KAO Journal of the Electrochemical Society1713
762018Effects of plating conditions on electroless Ni-P plating in the microchannelYang C.-Y; Hung H.-T; Robert Kao C.; C. ROBERT KAO 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 201810
772017Grain Boundary Penetration of Various Types of Ni Layer by Molten MetalsYang S.; Chang C.Y.; Zhu Z.X.; Lin Y.F.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials00
782017Contacts for PbTeLi C.-C.; Kao C.R.; C. ROBERT KAO Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems60
792017Critical Factors Affecting Structural Transformations in 3D IC Micro JointsYang H.W.; Yu H.Y.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference50
802017Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver JointYang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO Electronic Components and Technology Conference150
812017Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni PlatingHung H.T.; Yang S.; Chen Y.B.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2016
822017Micromechanical behavior of single-crystalline Cu 6 Sn 5 by picoindentationYu J.J.; Wu J.Y.; Yu L.J.; Yang H.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Science97
832017Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro jointsYang H.W.; Wu J.Y.; Zhu Z.X.; Kao C.R.; C. ROBERT KAO Materials Chemistry and Physics2020
842017Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid IntegrationYang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO Langmuir128
852017Micromechanical behavior of single crystalline Ni 3 Sn 4 in micro joints for chip-stacking applicationsYu L.J.; Yen H.W.; Wu J.Y.; Yu J.J.; C. ROBERT KAO ; HUNG-WEI YEN Materials Science and Engineering A1010
862016Study of Sintered Nano-Silver Die Attachment Materials Doped with IndiumYang C.A.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference90
872016Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni platingYang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO International Microsystems, Packaging, Assembly, and Circuits Technology Conference90
882016Choice of Intermetallic Compounds for Structural Applications in Near Submicron JointsYu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference30
892016Bonding of copper pillars using electroless Ni platingYang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO 2016 International Conference on Electronics Packaging30
902016Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation studyKe J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO Acta Materialia1914
912016Au-Sn bonding material for the assembly of power integrated circuit moduleZhu Z.X.; Li C.C.; Liao L.L.; Liu C.K.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds8076
922016Morphological evolution induced by volume shrinkage in micro jointsYang H.W.; Kao C.R.; C. ROBERT KAO 2016 International Conference on Electronics Packaging20
932016Full intermetallic joints for chip stacking by using thermal gradient bondingYang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; Kao C.R.; C. ROBERT KAO Acta Materialia6859
942016Novel Self-shrinking Mask for Sub-3 nm Pattern FabricationYang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN Scientific Reports912
952015In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro jointsYu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference20
962015Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID techniqueLi C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Electronic Components and Technology Conference20
972015Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applicationsYu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO Journal of Alloys and Compounds3231
982015Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materialsLi C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Journal of Materials Chemistry C3736
992015Mechanism of volume shrinkage during reaction between Ni and Ag-doped SnLi C.C.; Ke J.H.; Yang C.A.; Kao C.R.; C. ROBERT KAO Materials Letters1719
1002015Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinementYu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference10
1012015Low temperature bonding for high temperature applications by using SnBi soldersYang T.L.; Wu J.Y.; Li C.C.; Yang S.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds4441
1022015Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux dopingBashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; Kao C.R.; C. ROBERT KAO Journal of Materials Science4845
1032015Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigrationYang T.L.; Yu J.J.; Li C.C.; Lin Y.F.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds4038
1042015Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressingLi C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO Energy Conversion and Management2423
1052015Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic JointsYang T.-L.; Zhu Z.-X.; Yu J.-J.; Lin Y.-F.; Kao C.R.; C. ROBERT KAO Advanced Engineering Materials33
1062014Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layerYang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; C. ROBERT KAO ; C. ROBERT KAO Solar Energy Materials and Solar Cells3131
1072014Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuitsShih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials98
1082014Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During ReflowKey Chung C.; Zhu Z.X.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials33
1092014Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applicationsYang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference40
1102014Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni jointsLi C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science2725
1112014Phase field microelasticity model of dislocation climb: Methodology and applicationsKe J.H.; Boyne A.; Wang Y.; Kao C.R.; C. ROBERT KAO Acta Materialia2420
1122014Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressingHuang T.C.; Yang T.L.; Ke J.H.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO Scripta Materialia5552
1132014Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminalsLi C.C.; Shih W.L.; Chung C.K.; Kao C.R.; C. ROBERT KAO Corrosion Science76
1142014Effects of silver addition on Cu-Sn microjoints for chip-stacking applicationsYang T.L.; Yu J.J.; Shih W.L.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO Journal of Alloys and Compounds3938
1152013Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressingHuang, T.C.; Yang, T.L.; Ke, J.H.; Li, C.C.; C. ROBERT KAO ; C. ROBERT KAO Journal of Alloys and Compounds1818
1162013Au and Pd embrittlement in space-confined soldering reactions for 3D IC applicationsChen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials50
1172013Cu(TiWNx) film as a barrierless buffer layer for metallization applicationsLin C.-H.; Chuang H.-Y.; Kao C.R.; C. ROBERT KAO Japanese Journal of Applied Physics88
1182013Interfacial reactions and electromigration in flip-chip solder jointsHo C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO Advanced Flip Chip Packaging70
1192013Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnectionsChen Y.J.; Yang T.L.; Yu J.J.; Kao C.L.; C. ROBERT KAO ; C. ROBERT KAO Materials Letters1514
1202013Grain refinement of solder materials by minor element additionChung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO ; C. ROBERT KAO International Microsystems, Packaging, Assembly, and Circuits Technology Conference50
1212013Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallicsChen Y.J.; Chung C.K.; Yang C.R.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability5447
1222013Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applicationsYu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials10
1232013Serrated cathode dissolution under high current density: Morphology and root causeYang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO ; C. ROBERT KAO Journal of Applied Physics66
1242013Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bondingLi C.C.; Zhu Z.X.; Liao L.L.; Dai M.J.; Liu C.K.; Kao C.R.; C. ROBERT KAO Science and Technology of Welding and Joining77
1252013Volume shrinkage induced by interfacial reactions in micro jointsLi C.C.; Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO International Symposium on Advanced Packaging Materials20
1262013Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering processChung C.K.; Chen Y.J.; Yang T.L.; C. ROBERT KAO Journal of Electronic Materials97
1272013Reliability of micro-interconnects in 3D IC packagesRobert Kao, C.; Wu, Albert T.; Tu, King-Ning; Lai, Yi-Shao; C. ROBERT KAO Microelectronics Reliability87
1282012Soldering reactions under space confinement for 3D IC applicationsKao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO ; C. ROBERT KAO Electronic Components and Technology Conference100
1292012Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titaniumChen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference40
1302012Effects of Ti addition to Sn–Ag and Sn–Cu soldersChen, W.M.; Kang, S.K.; C. ROBERT KAO Journal of Alloys and Compounds 8374
1312012Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-AuKey Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO ; C. ROBERT KAO Journal of Alloys and Compounds79
1322012Critical concerns in soldering reactions arising from space confinement in 3-D IC packagesChuang H.Y.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO ; C. ROBERT KAO IEEE Transactions on Device and Materials Reliability8271
1332012Origin and evolution of voids in electroless Ni during soldering reactionChung C.K.; Chen Y.J.; Chen W.M.; Kao C.R.; C. ROBERT KAO Acta Materialia3231
1342012Elimination of voids in reactions between Ni and Sn: A novel effect of silverChuang, H.Y.; Yu, J.J.; Kuo, M.S.; Tong, H.M.; C. ROBERT KAO Scripta Materialia 7976
1352012Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressingKe, J.H.; Chuang, H.Y.; Shih, W.L.; C. ROBERT KAO Acta Materialia 6765
1362012The critical oxide thickness for Pb-free reflow soldering on Cu substrateChung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO Thin Solid Films 2623
1372011Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packagingChuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference180
1382011Laminar pattern induced by cycling thermomechanical stress in two-phase materialsChang, C.C.; Chen, Y.J.; Tsai, M.Y.; C. ROBERT KAO ; CHIEN-CHENG CHANG Materials Chemistry and Physics 00
1392011Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solderChang, C. C.; Yang, S. C.; Chen, Y. J.; C. ROBERT KAO ; CHIEN-CHENG CHANG International Journal of Materials Research01
1402011Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressingKe J.H.; Yang T.L.; Lai Y.S.; C. ROBERT KAO ; C. ROBERT KAO Acta Materialia5452
1412011Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bondingLu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference510
1422011The orientation relationship between Ni and Cu6Sn5 formed during the soldering reactionChen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO ; C. ROBERT KAO Scripta Materialia3030
1432011Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu JointsLiu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO Journal of electronic materials 3228
1442011Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current StressingTsai, M.Y.; Lin, Y.L.; Tsai, M.H.; Chen, Y.J.; C. ROBERT KAO Journal of ELECTRONIC MATERIALS 11
1452011Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bondingChen, Jiunn ; Lai, Yi-Shao; Wang, Yi-Wun; C. ROBERT KAO Microelectronics Reliability 4941
1462010Temperature effects on electromigration behavior of solder jointsKe J.-H.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference20
1472010Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature controlYang T.L.; C. ROBERT KAO ; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1482010Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder JointsTsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO Journal of electronic materials 22
1492010Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volumeChang C.C.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1502010Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrateChen W.M.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference00
1512010Novel Cu-RuNx composite layer with good solderability and very low consumption rateChuang, H.Y.; Lin, C.H.; Chu, J.P.; C. ROBERT KAO Journal of Alloys and Compounds 1111
1522010Oxidation behavior of ENIG and ENEPIG surface finishLee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference90
1532010Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and NiYang, S.C.; Chang, C.C.; Tsai, M.H.; C. ROBERT KAO ; CHIEN-CHENG CHANG Journal of Alloys and Compounds 4942
1542010Electromigration in flip chip solder joints under extra high current densityLin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; C. ROBERT KAO Journal of Applied Physics 2323
1552010Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn-Zn systemsTsai, M.Y.; Yang, S.C.; Wang, Y.W.; C. ROBERT KAO Journal of Alloys and Compounds 2425
1562010Uncovering the driving force for massive spalling in the Sn-Cu/Ni systemChen, W.M.; Yang, S.C.; Tsai, M.H.; C. ROBERT KAO Scripta Materialia 2725
1572010Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reactionChung, C.Key; Duh, Jenq-Gong; C. ROBERT KAO Scripta Materialia 4542
1582010The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow solderingChang, C.C.; Lin, Y.W.; Wang, Y.W.; C. ROBERT KAO ; CHIEN-CHENG CHANG Journal of Alloys and Compounds 9583
1592010Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactionsTsai, M.H.; Chen, W.M.; Tsai, M.Y.; C. ROBERT KAO Journal of Alloys and Compounds 1412
1602010Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead LayerCHIEN-CHENG CHANG ; Chung, H.Y.; Lai, Y.S.; C. ROBERT KAO Journal of electronic materials 97
1612010Effects of Ni Additions on the Growth of Cu3Sn in High-Lead SoldersWang, Y.W.; CHIEN-CHENG CHANG ; Chen, W.M.; C. ROBERT KAO Journal of Electronic Materials 77
1622010Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder JointsCHIEN-CHENG CHANG ; Wang, Y.W.; Lai, Y.S.; C. ROBERT KAO Journal of electronic materials 87
1632010Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to soldersWang, Y.W.; Lin, Y.W.; C. ROBERT KAO Journal of Alloys and Compounds 4436
1642009Journal of Electronic Materials: ForewordKang S.K.; Anderson I.; Chada S.; Duh J.-G.; Turbini L.J.; Wu A.; C. ROBERT KAO ; Hua F.; Subramanian K.N.; Frear D.; Handwerker C.; Guo F.; Chawla N.; Zeng, KejunJournal of Electronic Materials20
1652009Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voidsWang Y.W.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference00
1662009Development of lead-free solders with superior drop test reliability performanceWang Y.W.; Kao C.R.; C. ROBERT KAO 2009 International Conference on Electronic Packaging Technology and High Density Packaging60
1672009Effect of multiple reflow cycles on ball impact responses of SnAgCu solder jointsLai Y.; Chang H.; Kao C.; Kao C.R.; C. ROBERT KAO Soldering & Surface Mount Technology12
1682009Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrateTsai M.H.; Lin Y.W.; Chuang H.Y.; Kao C.R.; C. ROBERT KAO Journal of Materials Research109
1692009Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growthWang Y.W.; Chang C.C.; C. ROBERT KAO ; CHIEN-CHENG CHANG Journal of Alloys and Compounds9889
1702009Interfacial reaction and the dominant diffusing species in Mg-Ni systemTsai M.Y.; Chou M.H.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1917
1712009Interfacial reaction and wetting behavior between Pt and molten solderYang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO Journal of Electronic Materials1416
1722009Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSnChang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference20
1732009Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and CuWang Y.W.; Lin Y.W.; Tu C.T.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds168149
1742009Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substratesCHIEN-CHENG CHANG ; Lin Y.W.; Lai Y.S.; C. ROBERT KAO Journal of Electronic Materials65
1752009Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow solderingChang C.-C.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference10
1762009Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder jointsTsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO IMPACT Conference 2009 International 3D IC Conference10
1772009Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substratesWang Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Microelectronics Reliability9382
1782008物質跨越微電子銲點進行交互作用之尖端研究　（新制多年期第1年）高振宏 
1792008物質跨越微電子銲點進行交互作用之尖端研究　（新制多年期第2年）高振宏 
1802008電遷移對覆晶元件銲點之影響(3/3)高振宏 
1812008Microstructure study of high lead bump FCBGA bending testHung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1822008Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cuYang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO Journal of Electronic Materials1818
1832008Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technologyKao, C.R.; C. ROBERT KAO JOM00
1842008Pronounced electromigration of Cu in molten Sn-based soldersHuang J.R.; Tsai C.M.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Research5449
1852008Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New TechnologyKao, C. Robert JOM 
1862008Tin whisker growth induced by high electron current densityLin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2929
1872008Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finishLail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference10
1882008Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growthWang Y.W.; Kao C.R.; C. ROBERT KAO 2008 10th International Conference on Electronic Materials and Packaging40
1892008Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigrationLin Y.L.; Lai Y.S.; Lin Y.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials2317
1902007Effect of Zn addition on the interfacial reactions between Cu and lead-free soldersYang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO Materials Research Society Symposium1
1912007Dissolution and interfacial reaction between Cu and Sn-Ag-Cu soldersChang C.C.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference60
1922007Interfacial reaction issues for lead-free electronic soldersHo C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics250
1932007Cross-Interaction between Ni and Cu across Sn Layers with Different ThicknessChang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert Journal of Electronic Materials 
1942007Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active elementYang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Applied Physics4644
1952007Tin whisker growth induced by high electron current densityLin Y.W.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1962007Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systemsYang S.C.; Kao C.R.; C. ROBERT KAO Electronic Components and Technology Conference20
1972007The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interfaceWang Y.W.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference50
1982007Role of minor Zn addition in the interfacial reaction between lead-free solders and CuYang S.C.; Kao C.R.; C. ROBERT KAO 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference20
1992007Massive spalling of intermetallic compound in lead-free solder jointsYang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO Materials Research Society Symposium1
2002007Cross-interaction between Ni and Cu across Sn layers with different thicknessChang, C.W.; Yang, S.C.; Tu, C.-T.; Kao, C.R.; C. ROBERT KAO Journal of Electronic Materials6356
2012007Interfacial reaction issues for lead-free electronic soldersHo C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO Journal of Materials Science: Materials in Electronics289278
2022006化學工程與材料工程高振宏 化工技術 
2032006SnAgCu系列無鉛銲料應用於先進微電子封裝之研究高振宏 ; 楊素純工程科技通訊 
2042006Local melting induced by electromigration in flip-chip solder jointsTsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO ; C. ROBERT KAO Journal of Electronic Materials6057
2052006Journal of Electronic Materials: ForewordSuganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO Journal of Electronic Materials00
2062006Journal of Electronic Materials: ForewordChawla N.; Chada S.; Kang S.K.; C. ROBERT KAO ; Lin K.-L.; Lucas J.; Turbini L.Journal of Electronic Materials20
2072006Microstructure evolution of gold-tin eutectic solder on Cu and Ni substratesTsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO Journal of Electronic Materials4034
2082006Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couplesChang C.W.; Lee Q.P.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO Journal of Electronic Materials2423
2092006Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigrationLin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO Journal of Electronic Materials3127
2102006Effects of limited Cu supply on soldering reactions between SnAgCu and NiHo C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO ; C. ROBERT KAO Journal of Electronic Materials137115
2112006Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder jointsLin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; C. ROBERT KAO ; C. ROBERT KAO Journal of Electronic Materials4543
2122006Kinetics of AuSn 4 migration in lead-free soldersChang C.W.; Ho C.E.; Yang S.C.; C. ROBERT KAO Journal of Electronic Materials2320
2132006In-situ observation of material migration in flip-chip solder joints under current stressingTsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials99
2142006Special issue papers: Phase stability, phase transformations, and reactive phase formation in electronics materials IV - ForewordChen, S. W.; Kao, C. R.; Lee, H. M.; Mohney, S.; Suganuma, K.; Swenson, D. J.; Chada, S.; C. ROBERT KAO Journal of Electronic Materials41
2152006Strong Zn concentration effect on the soldering reactions between Sn-based solders and CuYang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO Journal of Materials Research8983
2162005Electromigration induced metal dissolution in flip-chip solder jointsLin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-54
2172005Volume effect on the soldering reaction between SnAgCu solders and NiHo C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces320
2182005Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigrattonWu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO Materials Research Society Symposium5
2192005In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressingLin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO Acta Materialia147139
2202005Electromigration induced metal dissolution in flip-chip solder jointsLin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO Materials Science Forum4
2212005Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrationsLuo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Materials Science and Engineering A115102
2222005Electromigration-induced failure in flip-chip solder jointsLin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; C. ROBERT KAO Journal of Electronic Materials10086
2232005Controlling the microstructures from the gold-tin reactionTsai J.Y.; Chang C.W.; Shieh Y.C.; Hu Y.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials10781
2242005Electromigration-induced grain rotation in anisotropic conducting beta tinWu A.T.; Gusak A.M.; Tu K.N.; Kao C.R.; C. ROBERT KAO Applied Physics Letters7770
2252004先進微電子封裝中錫銀銅銲料與金/鎳 表面處理層之界面反應羅偉誠 ; 蕭麗娟; 何政恩; 高振宏 Journal of the Chinese Colloid & Interface Science 
2262004Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - ForewordKao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. J.; C. ROBERT KAO Journal of Electronic Materials00
2272004Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffractionWu A.T.; Tu K.N.; Lloyd J.R.; Tamura N.; Valek B.C.; Kao C.R.; C. ROBERT KAO Applied Physics Letters6553
2282004Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder jointsTsai C.M.; Luo W.C.; Chang C.W.; Shieh Y.C.; C. ROBERT KAO Journal of Electronic Materials6357
2292004Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder jointsLin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO Journal of Electronic Materials1716
2302003大學化工熱力學課程發展之回顧高振宏 化工 
2312003SEM/EDS的原理與操作應用之簡介半導體工業構裝材料何政恩; 高振宏 化工技術 
2322003純物質織成核熱力學及動力學簡介蔡家銘; 高振宏 化工技術 
2332003錫銀銅銲料與鎳層反應時銅濃度效應之探討羅偉誠 ; 胡應強; 何政恩; 高振宏 Welding and Cutting 
2342003Special issue on lead-free solders and processing issues in microelectronic packaging - ForewordLucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO Journal of Electronic Materials41
2352003ForewordChen S.-W.; Lee H.M.; Swenson D.; C. ROBERT KAO ; Mohney S.E.; Notis M.R.Journal of Electronic Materials00
2362003Chemical reaction in solder joints of microelectronic packagesHo C.E.; Lin Y.L.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Chemical Engineers7
2372003A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of NiTsai J.Y.; Hu Y.C.; Tsai C.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials153135
2382003Recent progress in phase diagram calculation and applicationC. ROBERT KAO JOM11
2392003Electromigration failure in flip chip solder joints due to rapid dissolution of copperHu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO Journal of Materials Research133123
2402002構裝接點面面觀-鉍錫無鉛銲料系統胡應強; 陳琪; 徐敏雯; 高振宏 工業材料雜誌 
2412002抑制易脆之Au介金屬於微電子封裝銲點中生成之方法何政恩; 高振宏 知識創新 
2422002先進封裝技術中金脆效應對銲點影響之探討何政恩; 蕭麗娟; 高振宏 電子與材料 
2432002The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallizationTsai J.Y.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging110
2442002Electromigration in tin thin filmHu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging20
2452002Phase diagrams of important electronic materialsC. ROBERT KAO ; C. ROBERT KAO JOM55
2462002New failure mode induced by electric current in flip chip solder jointLin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 200210
2472002Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packagesLin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 200230
2482002Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder jointsHo C.E.; Shiau L.C.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials6560
2492002Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiHo C.E.; Tsai R.Y.; Lin Y.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials314279
2502002Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and NiHo C.E.; Lin Y.L.; C. ROBERT KAO ; C. ROBERT KAO Chemistry of Materials7773
2512002Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finishLuo W.-C.; Kao C.R.; C. ROBERT KAO 4th International Symposium on Electronic Materials and Packaging 2002140
2522002Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu soldersChen W.T.; Ho C.E.; Kao C.R.; C. ROBERT KAO Journal of Materials Research213191
2532002ForewordChada S.; Frear D.; Jin S.; Kang S.K.; C. ROBERT KAO ; Weiser, MartinJournal of Electronic Materials41
2542002Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesShiau L.C.; Ho C.E.; C. ROBERT KAO ; C. ROBERT KAO Soldering and Surface Mount Technology110101
2552001Interactions between solder and metallization during long-term aging of advanced microelectronic packagesHo C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials5757
2562001ForewordKang S.K.; Mavoori H.; Chada S.; C. ROBERT KAO ; Smith R.W.Journal of Electronic Materials106
2572001Selective interfacial reaction between Ni and eutectic BiSn lead-free solderTao W.H.; Chen C.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Chemistry of Materials6157
2582001Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finishLiu C.M.; Ho C.E.; Chen W.T.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials6558
2592001Reaction of solder with Ni/Au metallization for electronic packages during reflow solderingHo C.E.; Tsai S.Y.; Kao C.R.; C. ROBERT KAO IEEE Transactions on Advanced Packaging5845
2602000鎳與微電子用鉍錫銲料反應之研究高振宏 工程科技通訊 
2612000Optimizing the wire-bonding parameters for second bonds in ball grid array packagesHo C.E.; Chen C.; Kao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A/Chung-kuo Kung Ch'eng Hsuch K'an00
2622000Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finishHo C.E.; Zheng R.; Luo G.L.; Lin A.H.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials128122
2632000Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixtureLee, L. S.; Lin, C. W.; Kao, C. H.; C. ROBERT KAO Industrial & Engineering Chemistry Research1817
2642000Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrateChen C.; Ho C.E.; Lin A.H.; Luo G.L.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials5552
2651999微電子用鉍錫銲料與銅反應之研究高振宏 工程科技通訊 
2661999熱力學與相圖之關係何政恩; 蕭本俐; 高振宏 化工 
2671999Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallizationChen, C. P.; Lin, C. F.; Swenson, D.; Kao, C. R.; Jan, C. H.; Chang, Y. A.; C. ROBERT KAO Journal of Vacuum Science & Technology B02
2681999Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi systemLee S M.; Chen C.; Kao C.R.; C. ROBERT KAO Chemistry of Materials34
2691999Interfacial reactions between ni substrate and the component bi in soldersLee M.S.; Liu C.M.; C. ROBERT KAO Journal of Electronic Materials2829
2701999Binary compounds in the Ge-Ti systemJain T.A.; Kao C.R.; C. ROBERT KAO Journal of Alloys and Compounds1111
2711999Phase relation in the titanium-rich region of the Ge-Si-Ti ternary systemJain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO Materials Transactions74
2721999Reaction kinetics of solder-balls with pads in BGA packages during reflow solderingHo C.E.; Chen Y.M.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials8879
2731998銲接在電子工業上的應用陳琪; 高振宏 Welding and Cutting 
2741998Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and TiJain T.A.; Kao C.R.; C. ROBERT KAO Journal of Electronic Materials44
2751997半導體工業構裝材料高振宏 ; 李明勳化工技術 
2761997Calculation of low-temperature phase equilibria in the indium-lead systemKao C.R.; C. ROBERT KAO Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an11
2771997Reactions of solid copper with pure liquid tin and liquid tin saturated with copperHayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Scripta Materialia6460
2781997Microstructures developed in solid-liquid reactions: Using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examplesKao C.R.; C. ROBERT KAO Materials Science and Engineering A7269
2791996On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compoundsKao C.R.; C. ROBERT KAO Chinese Journal of Physics0
2801996Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide compositeKao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO TMS Annual Meeting1
2811996On the site preferences of ternary additions to triple defect B2 intermetallic compoundsPike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO TMS Annual Meeting1
2821996A mechanism for reactive diffusion between Si single crystal and NbC powder compactKao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO Journal of Materials Research98
2831995A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defectsChen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Intermetallics2326
2841995Diffusional behavior in B2 intermetallic compoundsKao C.R.; Kim S.; Chang Y.A.; C. ROBERT KAO Materials Science and Engineering A2723
2851995Synthesis of in situ composites through solid-state reactions: thermodynamic, mass-balance and kinetic considerationsKao C.R.; Woodford J.; Kim S.; Zhang M.-X.; Chang Y.A.; C. ROBERT KAO Materials Science and Engineering A1616
2861994Application of Thermodynamics, Phase-Equilibria and Kinetics to in-Situ Composite Synthesis Via Ternary Solid-State Displacement-ReactionsChang, Ya; Kao, Cr; C. ROBERT KAO Pure and Applied Chemistry1614
2871994Site preference of substitutional additions to triple-defect B2 intermetallic compoundsKao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO Intermetallics4747
2881993Phase equilibria of the cu-in system I: Experimental investigationBolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO Journal of Phase Equilibria600
2891993On the composition dependencies of self-diffusion coefficients in B2 intermetallic compoundsKao C.R.; Chang Y.A.; C. ROBERT KAO Intermetallics126109
2901993A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactionsKao C.R.; Chang Y.A.; C. ROBERT KAO Acta Metallurgica Et Materialia5351
2911993Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagramKao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO Journal of Phase Equilibria300
2921993On the optimization of solution model parameter values of phases and the calculation of phase diagramsChen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO Calphad89
2931990Model for micelle formation in copolymer/homopolymer blendsKao C.R.; De La Cruz M.O.; C. ROBERT KAO The Journal of Chemical Physics1515
2941988高階動態系統積分法則之開發與研究趙榮澄; 高振宏 ; 張志雄化工