第 1 到 15 筆結果,共 15 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2 | 2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
3 | 2006 | Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials | 31 | 27 | |
4 | 2006 | In-situ observation of material migration in flip-chip solder joints under current stressing | Tsai C.M.; Lai Y.-S.; Lin Y.L.; Chang C.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
5 | 2006 | Local melting induced by electromigration in flip-chip solder joints | Tsai C.M.; Lin Y.L.; Tsai J.Y.; Lai Y.I.-S.; C. ROBERT KAO | Journal of Electronic Materials | 61 | 58 | |
6 | 2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 40 | 34 | |
7 | 2006 | Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints | Lin Y.L.; Chang C.W.; Tsai C.M.; Lee C.W.; C. ROBERT KAO | Journal of Electronic Materials | 45 | 43 | |
8 | 2005 | Electromigration-induced failure in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials | 100 | 90 | |
9 | 2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin Y.H.; Tsai C.M.; Hu Y.C.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Materials Science Forum | |||
10 | 2005 | Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations | Luo W.C.; Ho C.E.; Tsai J.Y.; Lin Y.L.; C. ROBERT KAO | Materials Science and Engineering A | |||
11 | 2004 | Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints | Lin Y.L.; Luo W.C.; Lin Y.H.; Ho C.E.; C. ROBERT KAO | Journal of Electronic Materials | 17 | 16 | |
12 | 2003 | Chemical reaction in solder joints of microelectronic packages | Ho C.E.; Lin Y.L.; Tsai J.Y.; C. ROBERT KAO | Journal of the Chinese Institute of Chemical Engineers | |||
13 | 2002 | Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni | Ho C.E.; Lin Y.L.; C. ROBERT KAO | Chemistry of Materials | 77 | 73 | |
14 | 2002 | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages | Lin Y.L.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
15 | 2002 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Ho C.E.; Tsai R.Y.; Lin Y.L.; C. ROBERT KAO | Journal of Electronic Materials |