第 1 到 17 筆結果,共 17 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2019 | Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints | Yang T.H.; Yu H.Y.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2 | 2019 | Phase formation and microstructure evolution in Cu/In/Cu joints | Chiu Y.S.; Yu H.Y.; Hung H.T.; Wang Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
3 | 2019 | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | Wang Y.W.; Zhu Z.X.; Shih W.L.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
4 | 2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
5 | 2019 | Mechanical characterizations of single-crystalline (Cu, Ni) 6 Sn 5 through uniaxial micro-compression | Wu J.Y.; Chiu Y.S.; Wang Y.W.; C. ROBERT KAO | Materials Science and Engineering A | |||
6 | 2018 | Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications | Wang Y.W.; Yang T.L.; Wu J.Y.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
7 | 2018 | Materials merging mechanism of microfluidic electroless interconnection process | Yang S.; Hung H.T.; Wu P.Y.; Wang Y.W.; Nishikawa H.; C. ROBERT KAO | Journal of the Electrochemical Society | |||
8 | 2011 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding | Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
9 | 2009 | Interfacial reaction and wetting behavior between Pt and molten solder | Yang S.C.; Chang W.C.; Wang Y.W.; C. ROBERT KAO | Journal of Electronic Materials | 14 | 17 | |
10 | 2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
11 | 2009 | Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids | Wang Y.W.; C. ROBERT KAO | IMPACT Conference 2009 International 3D IC Conference | |||
12 | 2009 | Development of lead-free solders with superior drop test reliability performance | Wang Y.W.; C. ROBERT KAO | 2009 International Conference on Electronic Packaging Technology and High Density Packaging | |||
13 | 2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
14 | 2009 | Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth | Wang Y.W.; Chang C.C. ; C. ROBERT KAO | Journal of Alloys and Compounds | |||
15 | 2008 | Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth | Wang Y.W.; C. ROBERT KAO | 2008 10th International Conference on Electronic Materials and Packaging | |||
16 | 2008 | Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu | Yang S.C.; Wang Y.W.; CHIEN-CHENG CHANG ; C. ROBERT KAO | Journal of Electronic Materials | 18 | 18 | |
17 | 2007 | The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface | Wang Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference |