第 1 到 5 筆結果,共 5 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2019 | Micropillar mechanics of Sn-based intermetallic compounds | Yu, J.J.; Wu, J.Y.; Yu, L.J.; C. ROBERT KAO | Handbook of Mechanics of Materials | |||
2 | 2017 | Contacts for PbTe | Li C.-C.; C. ROBERT KAO | Advanced Thermoelectrics: Materials, Contacts, Devices, and Systems | |||
3 | 2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
4 | 2007 | Interfacial reaction issues for lead-free electronic solders | Ho C.E.; Yang S.C.; C. ROBERT KAO | Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics | |||
5 | 2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 |