Projects



Results 1-71 of 71 (Search time: 0.004 seconds).

Start DateTitleP-InvestigatorFunding Organization/經費來源
2023開發應用於高功率半導體封裝之新穎銀合金膠材料(3/4)C. ROBERT KAONational Science and Technology Council
2023開發應用於高功率半導體封裝之新穎銀合金膠材料(3/4)C. ROBERT KAONational Science and Technology Council
2023「高熵材料之學理與應用開發專案計畫」推動規劃計畫(2/3)C. ROBERT KAONational Science and Technology Council
2022開發應用於高功率半導體封裝之新穎銀合金膠材料(2/4)C. ROBERT KAONational Science and Technology Council
2022Development of Packaging Technology for High-Power and High- Temperature Power ICs by Sintered Ag-In Bonding ProcessC. ROBERT KAOHigher Education Sprout Project
2022「高熵材料之學理與應用開發專案計畫」推動規劃計畫(1/3)C. ROBERT KAONational Science and Technology Council
2022高等教育深耕計畫-核心研究群計畫【超柔韌耐彎折金屬導電線路連接材料研發】C. ROBERT KAOHigher Education Sprout Project
2020超薄層3D IC銲點界面反應之最終端行為之研究C. ROBERT KAONational Science and Technology Council
2020以燒結銀銦為接合技術之高溫高功率電力晶片封裝技術開發C. ROBERT KAONational Science and Technology Council
2020「高熵合金原理及開發專案計畫」推動規劃計畫(3/4)C. ROBERT KAONational Science and Technology Council
2019超薄層3D IC銲點界面反應之最終端行為之研究C. ROBERT KAONational Science and Technology Council
2019以燒結銀銦為接合技術之高溫高功率電力晶片封裝技術開發C. ROBERT KAONational Science and Technology Council
2019「高熵合金原理及開發專案計畫」推動規劃計畫(2/4)C. ROBERT KAONational Science and Technology Council
2019低應力無電鍍晶片堆疊之科技開發(3/3)C. ROBERT KAONational Science and Technology Council
2019高等教育深耕計畫-核心研究群計畫 【低溫低應力封裝技術開發】C. ROBERT KAOHigher Education Sprout Project
2018以燒結銀銦為接合技術之高溫高功率之電力晶片封裝技術開發C. ROBERT KAOHigher Education Sprout Project
2018超薄層3D IC銲點界面反應之最終端行為之研究C. ROBERT KAONational Science and Technology Council
2018以燒結銀銦為接合技術之高溫高功率電力晶片封裝技術開發C. ROBERT KAONational Science and Technology Council
2018「高熵合金原理及開發專案計畫」推動規劃計畫(1/4)C. ROBERT KAONational Science and Technology Council
2017以新穎方法量測3D IC微銲點中介金屬之機械性質C. ROBERT KAONational Science and Technology Council
2017中溫熱電發電模組構裝材料與技術之研發C. ROBERT KAONational Science and Technology Council
2017低應力無電鍍晶片堆疊之科技開發(1/3)C. ROBERT KAONational Science and Technology Council
2016以新穎方法量測3D IC微銲點中介金屬之機械性質C. ROBERT KAONational Science and Technology Council
2016中溫熱電發電模組構裝材料與技術之研發C. ROBERT KAONational Science and Technology Council
2016優勢重點領域拔尖計畫/子計畫4-三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2016材料工程學門研究發展及推動小組計畫C. ROBERT KAONational Science and Technology Council
2015以新穎方法量測3D IC微銲點中介金屬之機械性質C. ROBERT KAONational Science and Technology Council
2015中溫熱電發電模組構裝材料與技術之研發C. ROBERT KAONational Science and Technology Council
2015材料工程學門研究發展及推動小組計畫C. ROBERT KAONational Science and Technology Council
2015優勢重點領域拔尖計畫/子計畫4-三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2014電遷移導致大規模金屬消耗之研究:機制與防治手段C. ROBERT KAONational Science and Technology Council
2014探索 3D IC 微接點可靠度之關鍵因素暨新穎 3D IC 接合材料之研發C. ROBERT KAONational Science and Technology Council
2014材料工程學門研究發展及推動小組計畫C. ROBERT KAONational Science and Technology Council
2014優勢重點領域拔尖計畫/子計畫4-三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2013開發低溫且無須加壓下進行晶片對接之材料與技術(1/2)C. ROBERT KAONational Science and Technology Council
2013電遷移導致大規模金屬消耗之研究:機制與防治手段C. ROBERT KAONational Science and Technology Council
2013探索 3D IC 微接點可靠度之關鍵因素暨新穎 3D IC 接合材料之研發C. ROBERT KAONational Science and Technology Council
2013工程處材料學門國外參訪計畫C. ROBERT KAONational Science and Technology Council
2013優勢重點領域拔尖計畫/子計畫4-三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2013學術領域全面提升/工學院/材料科學與工程領域提升分項計畫C. ROBERT KAOMinistry of Education
2012電遷移導致大規模金屬消耗之研究:機制與防治手段C. ROBERT KAONational Science and Technology Council
2012探索 3D IC 微接點可靠度之關鍵因素暨新穎 3D IC 接合材料之研發C. ROBERT KAONational Science and Technology Council
2012子計畫4-三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2012細緻顯微組織之覆晶銲料開發C. ROBERT KAONational Science and Technology Council
2012學術領域全面提升/工學院/材料科學與工程領域提升分項計畫C. ROBERT KAOMinistry of Education
2011微量元素對微系統接點介面反應之影響C. ROBERT KAONational Science and Technology Council
2011微電子銲點中大規模剝離現象、其機制、及其防治手段之探討C. ROBERT KAONational Science and Technology Council
2011總計畫:探索尖端材料在微奈米尺度下之新穎機械行為-子計畫四:三維晶片新穎高強度微奈米接點之研發C. ROBERT KAOMinistry of Education
2011學術領域全面提升/工學院/材料科學與工程領域提升分項計畫C. ROBERT KAOMinistry of Education
2011學術領域全面提升/工學院/材料科學與工程領域推動學術國際化相關措施C. ROBERT KAOMinistry of Education
2011多方面積極參與國際才料相關學會實施計畫(1/1)C. ROBERT KAONational Science and Technology Council
2011超薄矽晶太陽電池封裝銲接材料與製程:錫銦系新型低溫低應力合金銲料之開發(I)C. ROBERT KAONational Science and Technology Council
2010三維立體晶片之尖端連接材料之研究(合作國家:美國)C. ROBERT KAONational Science and Technology Council
2010覆晶科技中電遷移擴散與化學位能擴散交互作用之尖端研究C. ROBERT KAONational Science and Technology Council
2010微量元素對微系統接點介面反應之影響C. ROBERT KAONational Science and Technology Council
2010微電子銲點中大規模剝離現象、其機制、及其防治手段之探討C. ROBERT KAONational Science and Technology Council
2009覆晶科技中電遷移擴散與化學位能擴散交互作用之尖端研究C. ROBERT KAONational Science and Technology Council
2009微量元素對微系統接點介面反應之影響C. ROBERT KAONational Science and Technology Council
2009微電子銲點中大規模剝離現象、其機制、及其防治手段之探討C. ROBERT KAONational Science and Technology Council
2009補助學者提昇國際影響力試辦方案-多方面積極參與國際材料相關學會實施計畫C. ROBERT KAONational Science and Technology Council
2009銲料中鋅濃度對介面反應之影響C. ROBERT KAONational Science and Technology Council
2008物質跨越微電子銲點進行交互作用之尖端研究(3/3)C. ROBERT KAONational Science and Technology Council
2008覆晶科技中電遷移擴散與化學位能擴散交互作用之尖端研究C. ROBERT KAONational Science and Technology Council
2008前瞻性與產學合作研究計畫/工學院/電子封裝內電致遷移對多相物質效應之基礎突破性研究C. ROBERT KAOMinistry of Education
2007電遷移對覆晶元件銲點之影響(3/3)C. ROBERT KAONational Science and Technology Council
2007物質跨越微電子銲點進行交互作用之尖端研究(2/3)C. ROBERT KAONational Science and Technology Council
2006電遷移對覆晶元件銲點之影響(2/3)C. ROBERT KAONational Science and Technology Council
2006物質跨越微電子銲點進行交互作用之尖端研究C. ROBERT KAONational Science and Technology Council
2005添加微量Fe、Co、Ni至無鉛銲料對界面生成物Cu3Sn厚度之影響C. ROBERT KAONational Science and Technology Council
2005以一種新技術來探討電遷移現象之基礎研究(3/3)C. ROBERT KAONational Science and Technology Council
2005電遷移對覆晶元件銲點之影響(1/3)C. ROBERT KAONational Science and Technology Council