https://scholars.lib.ntu.edu.tw/handle/123456789/148506
Title: | Full wave characterization of a through hole via discontinuity in multi-layered packaging | Authors: | Hsu, Show-Gwo Wu, Ruey-Beei |
Issue Date: | 1994 | Start page/Pages: | 219-222 | Source: | 3rd Topical Meeting on Electrical Performance of Electronic Packaging | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/310442 http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910032404/1/00594151.pdf |
DOI: | 10.1109/epep.1994.594151 |
Appears in Collections: | 電機工程學系 |
File | Description | Size | Format | |
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00594151.pdf | 282.51 kB | Adobe PDF | View/Open |
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