https://scholars.lib.ntu.edu.tw/handle/123456789/148871
Title: | Full Wave Characterization of a Through Hole Via Discontinuity in Multi- Layered Packaging | Authors: | Hsu, Show-Gwo Wu, Ruey-Beei |
Issue Date: | 1994 | Start page/Pages: | 219-222 | Source: | 1994 IEEE Electrical Performance of Electronic Packaging | DOI: | 10.1109/EPEP.1994.594151 |
Appears in Collections: | 電機工程學系 |
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