https://scholars.lib.ntu.edu.tw/handle/123456789/153186
Title: | Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines | Authors: | Shiue, Guang-Hwa RUEY-BEEI WU |
Issue Date: | 2003 | Start page/Pages: | 107-110 | Source: | Electrical Performance of Electronic Packaging | Abstract: | The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. The paper investigates the noise reduction by using differential signaling. A efficient 2D FDTD method together with equivalent circuits for the differential line and the slot is established and simulations are performed for a three-layer structure to characterize ground bounce coupling. © 2003 IEEE. |
URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/304065 http://ntur.lib.ntu.edu.tw/bitstream/246246/200704191002933/1/01250010.pdf https://www.scopus.com/inward/record.uri?eid=2-s2.0-34047195581&doi=10.1109%2fEPEP.2003.1250010&partnerID=40&md5=96d54659d4eb48094f8f4a6823348533 |
DOI: | 10.1109/epep.2003.1250010 | SDG/Keyword: | Electronics packaging; Equivalent circuits; Finite difference time domain method; 2-D FDTD method; Coupled microstrip lines; Differential lines; Differential signaling; Ground bounce; Return paths; Signal lines; Three-layer structures; Microstrip lines |
Appears in Collections: | 電機工程學系 |
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01250010.pdf | 193.66 kB | Adobe PDF | View/Open |
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