https://scholars.lib.ntu.edu.tw/handle/123456789/174048
Title: | Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology | Authors: | Chen, Tze Wee Chun, Jung Hoon Lu, Yi-chang Navid, R. Wang, Wei Chen, Chang-Lee Dutton, R.W. |
Issue Date: | 2009 | Journal Volume: | 56 | Journal Issue: | 4 | Start page/Pages: | 656-664 | Source: | IEEE Transactions on Electron Devices | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/237231 |
Appears in Collections: | 電子工程學研究所 |
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