https://scholars.lib.ntu.edu.tw/handle/123456789/317552
Title: | Full-wave characterization of a through hole via in multi-layered packaging | Authors: | Hsu, S. G. Wu, Ruey-Beei |
Issue Date: | 1995 | Journal Volume: | 43 | Journal Issue: | 5 | Start page/Pages: | 1073-1081 | Source: | IEEE Transactions on Microwave Theory and Techniques | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/317552 | DOI: | 10.1109/22.382068 |
Appears in Collections: | 電機工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.