https://scholars.lib.ntu.edu.tw/handle/123456789/362438
Title: | A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network | Authors: | Juang, T.-Y. Liu, J.-K. Chang, C.-C. Shau, S.-M. Tsai, M.-H. Dai, S.A. Su, W.-C. Lin, C.-H. Jeng, R.-J. RU-JONG JENG |
Issue Date: | 2011 | Journal Volume: | 18 | Journal Issue: | 5 | Start page/Pages: | 1169-1176 | Source: | Journal of Polymer Research | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-80053386674&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/362438 |
DOI: | 10.1007/s10965-010-9520-3 |
Appears in Collections: | 高分子科學與工程學研究所 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.