https://scholars.lib.ntu.edu.tw/handle/123456789/372710| Title: | A chip-package-board co-design methodology | Authors: | Lee, H.-C. Chang, Y.-W. YAO-WEN CHANG |
Issue Date: | 2012 | Start page/Pages: | 1082-1087 | Source: | Design Automation Conference | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84863543753&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/372710 |
DOI: | 10.1145/2228360.2228557 |
| Appears in Collections: | 電子工程學研究所 |
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