https://scholars.lib.ntu.edu.tw/handle/123456789/372794
Title: | A compact analytic model of the strain field induced by through silicon vias | Authors: | Jan, S.-R. Chou, T.-P. Yeh, C.-Y. Liu, C.W. Goldstein, R.V. Gorodtsov, V.A. Shushpannikov, P.S. CHEE-WEE LIU |
Issue Date: | 2012 | Journal Volume: | 59 | Journal Issue: | 3 | Start page/Pages: | 777-782 | Source: | IEEE Transactions on Electron Devices | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84862804253&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/372794 |
DOI: | 10.1109/TED.2011.2180534 |
Appears in Collections: | 電機工程學系 |
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