https://scholars.lib.ntu.edu.tw/handle/123456789/378696
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Liao, M.-H. | en_US |
dc.contributor.author | Chen, C.-H. | en_US |
dc.contributor.author | Lee, J.J. | en_US |
dc.contributor.author | Chen, K.C. | en_US |
dc.contributor.author | JYH-JONE LEE | en_US |
dc.creator | JYH-JONE LEE;Liang, J.H.;Chen, K.C.;Lee, J.J.;Chen, C.-H.;Liao, M.-H.;JYH-JONE LEE | - |
dc.date.accessioned | 2018-09-10T09:45:27Z | - |
dc.date.available | 2018-09-10T09:45:27Z | - |
dc.date.issued | 2013 | - |
dc.identifier.uri | http://www.scopus.com/inward/record.url?eid=2-s2.0-84898041415&partnerID=MN8TOARS | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/378696 | - |
dc.language | en | en |
dc.relation.ispartof | 2013 e-Manufacturing and Design Collaboration Symposium | - |
dc.source | AH | - |
dc.title | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | - |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/eMDC.2013.6756038 | - |
item.openairetype | conference paper | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Mechanical Engineering | - |
crisitem.author.orcid | 0000-0003-2942-4520 | - |
crisitem.author.orcid | 0000-0002-9418-4300 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 機械工程學系 |
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