https://scholars.lib.ntu.edu.tw/handle/123456789/414995
Title: | Analysis of fatigue life of electronic package under thermal cycling condition by acceleration model | Authors: | Hsu Y. Wu W.-F. Lu Y.-A. |
Issue Date: | 2015 | Publisher: | International Society of Science and Applied Technologies | Start page/Pages: | 146-149 | Source: | 21st ISSAT International Conference on Reliability and Quality in Design | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84945181147&partnerID=40&md5=7a92614b4094874d54efd9d61462c14e https://scholars.lib.ntu.edu.tw/handle/123456789/414995 |
ISBN: | 9780991057627 |
Appears in Collections: | 機械工程學系 |
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