https://scholars.lib.ntu.edu.tw/handle/123456789/415091
Title: | Quantitative Reliability Analysis of Electronic Packages in Consideration of Parameter Uncertainties | Authors: | Hsu, Y. Su, C.Y. Wu, W.F. |
Issue Date: | 2011 | Journal Volume: | Vol. 51 | Journal Issue: | Issue 12 | Start page/Pages: | pp. 2284-2289 | Source: | Microelectronics Reliability | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/415091 | DOI: | 10.1016/j.microrel.2011.04.019 |
Appears in Collections: | 機械工程學系 |
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