https://scholars.lib.ntu.edu.tw/handle/123456789/427878
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | K.-B. Wu | en_US |
dc.contributor.author | T.-Y. Kuo | en_US |
dc.contributor.author | B. Hung | en_US |
dc.contributor.author | B. Lin | en_US |
dc.contributor.author | C. Peng | en_US |
dc.contributor.author | M.-T. Yang | en_US |
dc.contributor.author | R.-B. Wu | en_US |
dc.contributor.author | RUEY-BEEI WU | en_US |
dc.creator | RUEY-BEEI WU;R.-B. Wu;M.-T. Yang;C. Peng;B. Lin;B. Hung;T.-Y. Kuo;K.-B. Wu | - |
dc.date.accessioned | 2019-10-24T08:05:03Z | - |
dc.date.available | 2019-10-24T08:05:03Z | - |
dc.date.issued | 2018 | - |
dc.identifier.issn | 21563950 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/427878 | - |
dc.relation.ispartof | IEEE Transactions on Components, Packaging, and Manufacturing Technology | - |
dc.title | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1109/tcpmt.2018.2850528 | - |
dc.identifier.scopus | 2-s2.0-85049135249 | - |
dc.relation.pages | 1675-1686 | - |
dc.relation.journalvolume | 8 | - |
dc.relation.journalissue | 8 | - |
item.fulltext | no fulltext | - |
item.cerifentitytype | Publications | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
crisitem.author.dept | Electrical Engineering | - |
crisitem.author.dept | Communication Engineering | - |
crisitem.author.dept | MediaTek-NTU Research Center | - |
crisitem.author.orcid | 0000-0001-5735-2152 | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | Others: University-Level Research Centers | - |
顯示於: | 電機工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。