https://scholars.lib.ntu.edu.tw/handle/123456789/427889
Title: | Semiconductor Package Assembly with Through Silicon Via Interconnect | Authors: | RUEY-BEEI WU | Issue Date: | 2018 | Patent Number: | US Patent 9,947,624 | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/427889 |
Appears in Collections: | 電機工程學系 |
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