https://scholars.lib.ntu.edu.tw/handle/123456789/432709
Title: | In-situ observation of material migration in flip-chip solder joints under current stressing | Authors: | Tsai C.M. Lai Y.-S. Lin Y.L. Chang C.W. C. ROBERT KAO |
Issue Date: | 2006 | Publisher: | Springer New York | Journal Volume: | 35 | Journal Issue: | 10 | Start page/Pages: | 1781-1786 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750181244&doi=10.1007%2fs11664-006-0157-2&partnerID=40&md5=357815571e6a54e43a89ac9d7051d3e3 https://scholars.lib.ntu.edu.tw/handle/123456789/432709 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-006-0157-2 |
Appears in Collections: | 材料科學與工程學系 |
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