https://scholars.lib.ntu.edu.tw/handle/123456789/432745| Title: | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Authors: | Ho C.E. Zheng R. Luo G.L. Lin A.H. Kao C.R. C. ROBERT KAO |
Issue Date: | 2000 | Publisher: | Minerals, Metals & Materials Soc (TMS), Warrendale | Journal Volume: | 29 | Journal Issue: | 10 | Start page/Pages: | 1175-1181 | Source: | Journal of Electronic Materials | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034295436&doi=10.1007%2fs11664-000-0010-y&partnerID=40&md5=8c6a57a06158fc9d48d529375de7fa8d https://scholars.lib.ntu.edu.tw/handle/123456789/432745 |
ISSN: | 03615235 | DOI: | 10.1007/s11664-000-0010-y |
| Appears in Collections: | 材料科學與工程學系 |
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