https://scholars.lib.ntu.edu.tw/handle/123456789/447953
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hsieh, C.-P. | en_US |
dc.contributor.author | Liao, M.-H. | en_US |
dc.contributor.author | Lee, C.-C. | en_US |
dc.contributor.author | Cheng, T.-C. | en_US |
dc.contributor.author | Wang, C.-P. | en_US |
dc.contributor.author | Huang, P.-C. | en_US |
dc.contributor.author | Cheng, S.-W. | en_US |
dc.contributor.author | MING-HAN LIAO | en_US |
dc.creator | MING-HAN LIAO;Cheng, S.-W.;Huang, P.-C.;Wang, C.-P.;Cheng, T.-C.;Lee, C.-C.;Liao, M.-H.;Hsieh, C.-P. | - |
dc.date.accessioned | 2020-01-13T08:22:35Z | - |
dc.date.available | 2020-01-13T08:22:35Z | - |
dc.date.issued | 2016 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/447953 | - |
dc.relation.ispartof | Thin Solid Films | - |
dc.title | Shallow trench isolation geometric influence of a recessed surface on array-type arrangements of nano-scaled devices strained by contact etch stop liner and Ge-based stressors | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/j.tsf.2016.03.015 | - |
dc.identifier.scopus | 2-s2.0-84961226283 | - |
dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84961226283&doi=10.1016%2fj.tsf.2016.03.015&partnerID=40&md5=d188bc06b92a8b4a42e99e5847db84f0 | - |
dc.relation.pages | 172-177 | - |
dc.relation.journalvolume | 618 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.orcid | 0000-0003-2942-4520 | - |
顯示於: | 機械工程學系 |
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