https://scholars.lib.ntu.edu.tw/handle/123456789/447957| Title: | Erratum: The novel chamber hardware design to improve the thin film deposition quality in both 12″ (300 mm) and 18″ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique; (AIP Advances (2013) 3:7 (072117)) | Authors: | Liao, M.-H. MING-HAN LIAO MING-HAN LIAO |
Issue Date: | 2015 | Journal Volume: | 5 | Journal Issue: | 4 | Source: | AIP Advances | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/447957 | ISSN: | 21583226 | DOI: | 10.1063/1.4918681 |
| Appears in Collections: | 機械工程學系 |
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