https://scholars.lib.ntu.edu.tw/handle/123456789/447961
Title: | The special trench design near the through silicon vias (TSVs) to reduce the keep-out zone for application in three-dimensional integral circuits | Authors: | Liao, M.-H. MING-HAN LIAO |
Issue Date: | 2013 | Journal Volume: | 46 | Journal Issue: | 49 | Source: | Journal of Physics D: Applied Physics | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/447961 | DOI: | 10.1088/0022-3727/46/49/495103 |
Appears in Collections: | 機械工程學系 |
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