https://scholars.lib.ntu.edu.tw/handle/123456789/490964
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang, C.W. | en_US |
dc.contributor.author | Yang, S.C. | en_US |
dc.contributor.author | Tu, C.-T. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao, C.R.;Tu, C.-T.;Yang, S.C.;Chang, C.W. | - |
dc.date.accessioned | 2020-05-12T02:49:04Z | - |
dc.date.available | 2020-05-12T02:49:04Z | - |
dc.date.issued | 2007 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/490964 | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Cross-interaction between Ni and Cu across Sn layers with different thickness | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1007/s11664-007-0235-0 | - |
dc.identifier.scopus | 2-s2.0-35248839558 | - |
dc.identifier.url | https://www.scopus.com/inward/record.uri?eid=2-s2.0-35248839558&doi=10.1007%2fs11664-007-0235-0&partnerID=40&md5=782dfa659abef376f6b91167b74b3c85 | - |
dc.relation.pages | 1455-1461 | - |
dc.relation.journalvolume | 36 | - |
dc.relation.journalissue | 11 | - |
item.cerifentitytype | Publications | - |
item.openairetype | conference paper | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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