https://scholars.lib.ntu.edu.tw/handle/123456789/492016
Title: | Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads | Authors: | Liu, Y.U.-C. Lin, W.-H. Lin, H.-J. Chuang, T.-H. TUNG-HAN CHUANG |
Issue Date: | 2006 | Journal Volume: | 35 | Journal Issue: | 1 | Start page/Pages: | 147-153 | Source: | Journal of Electronic Materials | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/492016 | DOI: | 10.1007/s11664-006-0197-7 |
Appears in Collections: | 材料科學與工程學系 |
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