https://scholars.lib.ntu.edu.tw/handle/123456789/492017
Title: | Characterization of thin films and intermetallic compounds in solder joint | Authors: | Tsai, I. Tai, L.J. Yen, S.F. Chuang, T.H. Lo, R. Ku, T. Wu, E. TUNG-HAN CHUANG |
Issue Date: | 2005 | Journal Volume: | 2005 | Start page/Pages: | 703-705 | Source: | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/492017 | DOI: | 10.1109/ESIME.2005.1502892 |
Appears in Collections: | 材料科學與工程學系 |
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