https://scholars.lib.ntu.edu.tw/handle/123456789/546625
標題: | Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs | 作者: | Tsai, C.-H. Huang, W.-C. Kao, C.R. Chew, L.M. Schmitt, W. Nishikawa, H. C. ROBERT KAO |
公開日期: | 2020 | 卷: | 2020-June | 起(迄)頁: | 1430-1435 | 來源出版物: | Proceedings - Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.url?eid=2-s2.0-85090295378&partnerID=40&md5=1dbf0c7aecdfe51299fff0014153dfe3 https://scholars.lib.ntu.edu.tw/handle/123456789/546625 |
DOI: | 10.1109/ECTC32862.2020.00226 |
顯示於: | 材料科學與工程學系 |
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