|Title:||The demonstration of Carbon Nano-Tubes (CNTs) as a promising high Aspect Ratio (>25) through Silicon Vias (TSVs) material for the vertical connection in the high dense 3DICs||Authors:||Lu P.-Y
|Keywords:||Aspect ratio; Carbon nanotubes; Elastic moduli; Electron devices; Electronics packaging; Integrated circuit interconnects; Iron compounds; Laser materials processing; Silicon wafers; Temperature; Thermal conductivity; Thermal expansion; Wafer bonding; 3d integrated circuit (ICs); Carbon nano tube (CNTs); Device temperature; Electrical performance; High aspect ratio; Through silicon vias; Wafer bonding process; Wafer transfer technologies; Three dimensional integrated circuits||Issue Date:||2020||Journal Volume:||2020-December||Start page/Pages:||12.6.1-12.6.4||Source:||Technical Digest - International Electron Devices Meeting, IEDM||Abstract:||
With the excellent material properties of Carbon Nano-tubes (CNTs) developed in this work (Coefficient of Thermal Expansion~-2 x 10-6 K-1, Resistivity~10-6 Ω-m, Young's modulus~1000 GPa, and thermal conductivity ~800 Wm-1K-1), the real 3D integrated circuits (ICs) system with CNTs as the high aspect ratio (>25)/small diameters (<5 μm) Through Silicon Vias (TSVs) is demonstrated. The device temperature can be reduced ~15 °C and the keep-out zone region can be reduced ~80%. on the other hand, the CNTs 3DICs system also shows that the better system-level electrical performance from the latency, bandwidth density, power density, and reliability (~10X) points of view. The developed technologies including (1) High quality CNTs growing at the low temperature (550 °C) using a novel gas Fe(C5H5)2 reactant, (2) Optimized wafer bonding process, (3) Non-mask laser engrave patterning, and (4) wafer transfer technology by a thermal release tape/ethylene viny acetate processes provide the useful solution for the applications of CNTs as a vertical connection material in the near coming high-density 3D device. ? 2020 IEEE.
|Appears in Collections:||機械工程學系|
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