https://scholars.lib.ntu.edu.tw/handle/123456789/576878
標題: | Effects of plating conditions on electroless Ni-P plating in the microchannel | 作者: | Yang C.-Y Hung H.-T Robert Kao C. C. ROBERT KAO |
關鍵字: | Electronics packaging; Flow fields; Flow rate; Flow velocity; Microchannels; Nickel compounds; Temperature; Controlled flow; Cu interconnections; Electroless ni-p plating; High flow velocity; Local flow field; Low temperatures; Operating temperature; Plating conditions; Plating | 公開日期: | 2018 | 起(迄)頁: | 74-77 | 來源出版物: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 | 摘要: | Controlled flow electroless Ni-P plating in microchannel has been shown to provide a route for low-Temperature and pressureless Cu-To-Cu interconnections [1]. However, it is found that operating temperature, flow rate, and local flow field would affect plating result. Operating temperature is related to the activity of the plating bath, and raising the operating temperature would promote electroless Ni-P plating. Flow rate determines the time during which the plating bath passes through the test vehicle. Increasing flow rate would increase the unplated area. Local flow field is determined by flow rate and the geometry of the Cu pattern in the microchannel. Low-flow velocity region tends to have the higher plating rate while high-flow velocity region tends to have lower plating rate. ? 2018 Japan Institute of Electronics Packaging. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048892731&doi=10.23919%2fICEP.2018.8374673&partnerID=40&md5=e9c3b8729b0adb47edbe2e06da717f90 https://scholars.lib.ntu.edu.tw/handle/123456789/576878 |
DOI: | 10.23919/ICEP.2018.8374673 |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。